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FAN3226 PDF预览

FAN3226

更新时间： 2024-01-18 10:44:10
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 驱动器栅极栅极驱动
页数 文件大小 规格书
24页 1302K
描述
Dual 2A High-Speed, Low-Side Gate Drivers

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FAN3226 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Transferred零件包装代码：SOIC
包装说明：SOP, SOP8,.25针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.31.00.01风险等级：4.29
高边驱动器：NO接口集成电路类型：HALF BRIDGE BASED MOSFET DRIVER
JESD-30 代码：R-PDSO-G8JESD-609代码：e4
长度：5 mm湿度敏感等级：1
功能数量：1端子数量：8
最高工作温度：125 °C最低工作温度：-40 °C
标称输出峰值电流：3 A封装主体材料：PLASTIC/EPOXY
封装代码：SOP封装等效代码：SOP8,.25
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
认证状态：Not Qualified座面最大高度：1.75 mm
最大供电电压：18 V最小供电电压：4.5 V
标称供电电压：12 V表面贴装：YES
温度等级：AUTOMOTIVE端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：1.27 mm
端子位置：DUAL断开时间：0.022 µs
接通时间：0.017 µs宽度：4 mm
Base Number Matches：1

FAN3226 数据手册

 浏览型号FAN3226的Datasheet PDF文件第1页浏览型号FAN3226的Datasheet PDF文件第3页浏览型号FAN3226的Datasheet PDF文件第4页浏览型号FAN3226的Datasheet PDF文件第5页浏览型号FAN3226的Datasheet PDF文件第6页浏览型号FAN3226的Datasheet PDF文件第7页 
Ordering Information  
Input  
Threshold  
Quantity  
per Reel  
Part Number  
Logic  
Package  
Packing Method  
FAN3226CMPX  
FAN3226CMX  
FAN3226TMPX  
FAN3226TMX  
FAN3227CMPX  
FAN3227CMX  
FAN3227TMPX  
FAN3227TMX  
FAN3228CMPX  
FAN3228CMX  
FAN3228TMPX  
FAN3228TMX  
FAN3229CMPX  
FAN3229CMX  
FAN3229TMPX  
FAN3229TMX  
3x3mm MLP-8  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
Tape & Reel  
3,000  
2,500  
3,000  
2,500  
3,000  
2,500  
3,000  
2,500  
3,000  
2,500  
3,000  
2,500  
3,000  
2,500  
3,000  
2,500  
CMOS  
TTL  
SOIC-8  
Dual Inverting Channels +  
Dual Enable  
3x3mm MLP-8  
SOIC-8  
3x3mm MLP-8  
SOIC-8  
CMOS  
TTL  
Dual Non-Inverting Channels  
+ Dual Enable  
3x3mm MLP-8  
SOIC-8  
3x3mm MLP-8  
SOIC-8  
CMOS  
TTL  
Dual Channels of Two-Input /  
One-Output Drivers, Pin  
Configuration 1  
3x3mm MLP-8  
SOIC-8  
3x3mm MLP-8  
SOIC-8  
CMOS  
TTL  
Dual Channels of Two-Input /  
One-Output Drivers, Pin  
Configuration 2  
3x3mm MLP-8  
SOIC-8  
All standard Fairchild Semiconductor products are RoHS compliant and many are also “GREEN” or going green. For Fairchild’s  
definition of “green” please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.  
Package Outlines  
Figure 2. 3x3mm MLP-8 (Top View)  
Figure 3. SOIC-8 (Top View)  
Thermal Characteristics(1)  
(2)  
(3)  
(4)  
(5)  
(6)  
Package  
Units  
ΘJL  
ΘJT  
ΘJA  
ΨJB  
ΨJT  
8-Lead 3x3mm Molded Leadless Package (MLP)  
8-Pin Small Outline Integrated Circuit (SOIC)  
Notes:  
1.6  
40  
68  
31  
43  
89  
3.5  
43  
0.8  
3.0  
°C/W  
°C/W  
1. Estimates derived from thermal simulation; actual values depend on the application.  
2. Theta_JL (ΘJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any  
thermal pad) that are typically soldered to a PCB.  
3. Theta_JT (ΘJT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is  
held at a uniform temperature by a top-side heatsink.  
4. Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.  
The value given is for natural convection with no heatsink, as specified in JEDEC standards JESD51-2, JESD51-5, and  
JESD51-7, as appropriate.  
5. Psi_JB (ΨJB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an  
application circuit board reference point for the thermal environment defined in Note 4. For the MLP-8 package, the board  
reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the  
SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.  
6. Psi_JT (ΨJT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and  
the center of the top of the package for the thermal environment defined in Note 4.  
© 2007 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN3226 / FAN3227 / FAN3228 / FAN3229 • Rev. 1.0.3  
2
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