Datasheet > F0603E1R50FWTR

F0603E1R50FWTR

更新时间： 2022-09-29 19:00:20

品牌	Logo	应用领域
京瓷/艾维克斯 - KYOCERA AVX		/
页数	文件大小	规格书
17页	958K
描述
FUSE BOARD MOUNT 1.5A 32VDC 0603

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F0603E1R50FWTR 数据手册

Accu-Guard^®II

SMD Thin-Film Fuse

ENVIRONMENTAL CHARACTERISTICS

Test

Conditions

Required

Components completely immersed in a solder

bath at 235 ±5°C for 2 secs.

Solderability

Leach Resistance

Storage

Terminations to be well tinned No visible damage

Dissolution of termination

≤ 25% of area

∆R/R<10%

Completely immersed in a solder bath at 260 ±5°C

for 60 secs

12 months minimum with components stored in

“as received” packaging.

Good solderability

Components mounted to a substrate.

A force of 5N applied normal to the line joining the No visible damage

terminations and in a line parallel to the substrate

Shear

Rapid Change of

Temperature

Components mounted to a substrate. 50 cycles

-55° to +125°C.

No Visible damage

∆R/R<10%

Components mounted to substrate.

No Visible damage

Vibration

50 cycles -55°C to +125°C.

∆R/R<10%

Components mounted to substrate.

50 cycles -55°C to +125°C.

No Visible damage

∆R/R<10%

Tested as shown in diagram

3 mm

Deflection

No visible damage

∆R/R<10%

Bend

45mm

Load Life

F0805B, F1206B

No visible damage

∆R/R<10%

25°C, rated current, 20,000 hrs.

The Important Information/Disclaimer is incorporated in the catalog where these speciﬁcations came from or available

online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

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