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F0603G0R02FNTR PDF预览

F0603G0R02FNTR

更新时间: 2024-12-02 11:16:31
品牌 Logo 应用领域
京瓷/艾维克斯 - KYOCERA AVX 电路保护电熔丝
页数 文件大小 规格书
4页 183K
描述
Thin Film Fuse LGA

F0603G0R02FNTR 数据手册

 浏览型号F0603G0R02FNTR的Datasheet PDF文件第2页浏览型号F0603G0R02FNTR的Datasheet PDF文件第3页浏览型号F0603G0R02FNTR的Datasheet PDF文件第4页 
Accu-Guard® II Low Current  
Miniature 0402 Size Thin-Film Fuses  
The new F0402G Accu-Guard® series of fuses is based on  
thin-film technology which allows precise control of the  
component electrical and physical characteristics that is not  
possible with standard fuse technologies. The Accu-Guard  
Low Current series encompasses the lowest current ratings  
in a compact 0402 package and features LGA terminations.  
ELECTRICAL SPECIFICATIONS  
Operating temperature: -55ºC to +125ºC  
RECOMMEND PAD LAYOUT  
millimeters (inches)  
Current carrying capacity:  
-55ºC to -11ºC 107% of rating  
-10ºC to +60ºC 100% of rating  
+61ºC to +100°C 85% of rating  
+101ºC to +125°C 80% of rating  
0.55  
(0.022)  
Rated voltage: 32V  
Post-fusing resistance: >1MΩ  
0.31 (0.012)  
1.15 (0.045)  
Current  
Rating  
A
0.050  
0.062  
0.075  
0.100  
0.125  
0.150  
0.200  
Resistance  
@0.1 x IRATED  
Ω (max.)  
3.4  
Voltage Drop  
Fusing Current  
(within 5 sec)  
A
Pre-Arc I2t  
@10xIRATED  
A2-sec (typ)  
2 x 10-6  
Color  
Code  
Part Number  
@IRATED  
mV (max.)  
250  
F0402G0R05FNTR  
F0402G0R06FNTR  
F0402G0R07FNTR  
F0402G0R10FNTR  
F0402G0R12FNTR  
F0402G0R15FNTR  
F0402G0R20FNTR  
0.125  
0.155  
0.1875  
0.250  
0.312  
0.375  
0.500  
Blue  
Yellow  
Brown  
Red  
White  
Green  
Pink  
2.5  
2.0  
2.4  
1.6  
1.2  
0.8  
280  
280  
300  
250  
220  
210  
2 x 10-6  
4 x 10-6  
7 x 10-6  
1 x 10-5  
2 x 10-5  
4 x 10-5  
ENVIRONMENTAL CHARACTERISTICS  
Test  
Conditions  
Requirement  
Solderability  
Components completely immersed in a  
solder bath at 245 5°C for 3 secs.  
Components completely immersed in a solder  
bath at 255 5°C for 60 secs.  
12 months minimum with components  
stored in “as received” packaging.  
Components mounted to a substrate.  
Increasing shearing force applied paralled to  
the sufstrate till destruction.  
Total area of imperfections in solder coating  
up to 5% of the land suface area  
Dissolution of termination  
≤ 15% of the land surface area  
Good solderability  
Leach Resistance  
Storage  
Shear  
Destruction at 5N force minimum  
Temperature  
Cycling  
Bend  
Components mounted to a flexible substrate  
(e.g. FR – 4). 1000 cycles -55ºC to +125ºC.  
Tested as shown in diagram  
No Visible damage  
ΔR/R<10%  
No visible damage  
ΔR/R<10%  
3 mm  
Deflection  
45mm  
45mm  

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