Datasheet > EZR32LG330F64R63G-B0

EZR32LG330F64R63G-B0

更新时间： 2022-12-29 19:32:36

品牌	Logo	应用领域
芯科 - SILICON		/
页数	文件大小	规格书
4页	163K
描述
This change does not impact form, function, quality or reliability.

阅读下载

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

EZR32LG330F64R63G-B0 数据手册

浏览型号EZR32LG330F64R63G-B0的Datasheet PDF文件第2页

浏览型号EZR32LG330F64R63G-B0的Datasheet PDF文件第3页

浏览型号EZR32LG330F64R63G-B0的Datasheet PDF文件第4页

Process Change Notice #1506172

____________________________________________________________________________________________________

User Registration

updates, new product announcements, “how-to” and design documents, product change notices (PCN) and other valuable content

available only to registered users. http://www.silabs.com/profile

PCN Date: 6/17/2015

Effective Date: 6/17/2015

Title: EZR32LG and EZR32WG Data sheet Revision Notification

Originator: Kavita Char

Phone: 408-702-1297

Phone: 512-532-5261

Dept: SRW Marketing

Dept: Sales

Customer Contact: Kathy Haggar

PCN Type:

☒ Data sheet

☐ Foundry

☐ Packing

☐ Product Revision

☐ Assembly

☐ Test

☐ Labeling

☐ Other

☐ Discontinuance

Last Order Date: Not Applicable

PCN Details

Description of Change:

Silicon Labs is pleased to announce availability of v1.1 of EZR32LG and EZR32WG wireless MCU data

sheets. The affected data sheets are: EZR32LG230, EZR32LG330, EZR32WG230 and EZR32WG330.

The new data sheet revision includes the changes listed below:

•

Updated OPNs in Ordering Section.

USART0 in Configuration Summary table changed to USARTRF0.

Sleep current corrected from 40 nA to 20 nA.

GPIO number corrected from 41 to 38.

Number of operational amplifiers corrected from 3 to 2.

Added "EZRadio and EZRadioPRO Transceivers GPIO Configuration" section.

Updated Table 5.1 Device Pinout: Revised Pin 10, Pin 11, Pin 61, and Pin 62.

Updated Table 5.2 Alternate Functionality Overview: Removed GPIO0 and GPIO1.

Revised Top Marking Table: Corrected Line 2 Marking row.

Revised Table 3.2 Configuration Table: Added USB.

Updated Section 5.6 (QFN64 Package) and Table 5.4 (QFN64 package dimensions)*.

Updated Section 6.1—PCB Land Pattern Dimensions *

* This revision reflects the actual package dimension that is in production and affects only the

documentation. There is no change to the package/product.

Reason for Change:

Updated data sheets to include new radio sub-section describing the MCU-RF interface, updated

device package dimensions and updates to pinout tables and features section.

Impact on Form, Fit, Function, Quality, Reliability:

This change does not impact form, function, quality or reliability. The fit of the actual product is

not changing; however, the package dimensions are being corrected in the data sheets to reflect

the actual dimensions of the product.

W7206F1 Process Change Notice Form rev AU

The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in

part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 4

12 3 4

下载PDF

与EZR32LG330F64R63G-B0相关器件

型号	品牌	描述	获取价格	数据表
EZR32LG330F64R63G-B0R	SILICON	This change does not impact form, function, quality or reliability.	获取价格
EZR32LG330F64R67G	SILICON	EZR32LG330F64R67G EZR32 1 GHz 以下无线微控制器 (MCU)	获取价格
EZR32LG330F64R67G-B0	SILICON	This change does not impact form, function, quality or reliability.	获取价格
EZR32LG330F64R67G-B0R	SILICON	This change does not impact form, function, quality or reliability.	获取价格
EZR32LG330F64R68G	SILICON	EZR32LG330F64R68G EZR32 1 GHz 以下无线微控制器 (MCU)	获取价格
EZR32LG330F64R68G-B0	SILICON	This change does not impact form, function, quality or reliability.	获取价格

产品中心

服务支持

精选活动

关于我们

帮助中心

EZR32LG330F64R63G-B0

EZR32LG330F64R63G-B0 数据手册

与EZR32LG330F64R63G-B0相关器件

与EZR32LG330F64R63G-B0相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

EZR32LG330F64R63G-B0

EZR32LG330F64R63G-B0 数据手册

与EZR32LG330F64R63G-B0相关器件

与EZR32LG330F64R63G-B0相关文章

您还可以找

您在本页遇到什么问题？