PART NUMBERING GUIDE
EP26 00 ET T TS - 24.000M TR
FREQUENCY TOLERANCE / STABILITY
00=±±00ppm Maximum
45=±50ppm Maximum
AVAILABLE OPTIONS
Blank=Bulk
TR=Tape & Reel
OPERATING TEMP. RANGE
Blank=-20°C to 70°C or
ET=-40°C to 85°C
FREQUENCY
OUTPUT CONTROL FUNCTION
TS=Tri-State
PD=Power Down
DUTY CYCLE
Blank=50 ±±0(%)
T=50 ±5(%)
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
7.00
0.15
5.08
0.15
4
3
ꢀ
MARKING
5.00
ORIENTATION
0.15
ꢀ.ꢀ0
0.15
1
1.4 0.ꢀ
1.4 0.1
3.68
0.15
1.60 0.ꢀ0
Pin ±: Tri-State or Power Down
Pin 2: Case Ground
Pin 3: Output
Pin 4: Supply Voltage
Tolerances = +0.±
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
M
±.5 MIN
N
50 MIN
O
P
±3±.2
Q
REEL
A
B
7.5±.±
C
D
4 ±.±
E
2±.±
F
TAPE
20.2 MIN
40 MIN
±6+.3-.±
6.75±.±
R
S
T
U
V
QTY/REEL
±,000
F
8±.±
G
B0*
H
J
A0*
K
L
K0*
2.5 MIN
±0 MIN
22.4 MAX 360 MAX
±6.4+2-0
±.5 +.±-0
.3 ±.05
*Compliant to EIA 48±A
MARKING SPECIFICATIONS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
Characteristic
Specification
Line ±: ECLIPTEK
Line 2: XX.XXX M
ESD Susceptibility
Fine Leak Test
Flammability
MIL-STD-883, Method 30±5, Class ±, HBM: ±500V
MIL-STD-883, Method ±0±4, Condition A
UL94-V0
Frequency in MHz (5 Digits Maximum + Decimal)
Gross Leak Test
MIL-STD-883, Method ±0±4, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method ±004
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
J-STD-020, MSL ±
Line 3: P XX Y ZZ
MIL-STD-202, Method 2±0, Condition K
MIL-STD-202, Method 2±5
MIL-STD-883, Method 2003
Week of Year
Last Digit of Year
Temperature Cycling
Vibration
MIL-STD-883, Method ±0±0, Condition B
MIL-STD-883, Method 2007, Condition A
Ecliptek Manufacturing Identifier
Configuration Designator
MANUFACTURER
CATEGORY
SERIES
PACKAGE
VOLTAGE
CLASS
REV.DATE
ECLIPTEK CORP.
OSCILLATOR
EP26
CERAMIC
3.3V
OS48
07/08
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.