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ELJPB121KF PDF预览

ELJPB121KF

更新时间: 2024-02-11 03:35:43
品牌 Logo 应用领域
松下 - PANASONIC PC
页数 文件大小 规格书
7页 231K
描述
High Power Type PF, PE, PC, PA, PB

ELJPB121KF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:1812
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8504.50.80.00风险等级:5.82
大小写代码:1812构造:Molded Chip
型芯材料:CERAMIC直流电阻:4.5 Ω
标称电感 (L):120 µH电感器应用:RF INDUCTOR
电感器类型:GENERAL PURPOSE INDUCTORJESD-609代码:e2
功能数量:1端子数量:2
最高工作温度:85 °C最低工作温度:-20 °C
封装高度:3.2 mm封装长度:4.5 mm
封装形式:SMT封装宽度:3.2 mm
包装方法:TR最小质量因数(标称电感时):20
最大额定电流:0.13 A自谐振频率:5.5 MHz
形状/尺寸说明:RECTANGULAR PACKAGE屏蔽:NO
表面贴装:YES端子面层:Tin/Copper (Sn/Cu)
端子位置:DUAL ENDED端子形状:WRAPAROUND
测试频率:0.796 MHz容差:10%
Base Number Matches:1

ELJPB121KF 数据手册

 浏览型号ELJPB121KF的Datasheet PDF文件第2页浏览型号ELJPB121KF的Datasheet PDF文件第3页浏览型号ELJPB121KF的Datasheet PDF文件第4页浏览型号ELJPB121KF的Datasheet PDF文件第5页浏览型号ELJPB121KF的Datasheet PDF文件第6页浏览型号ELJPB121KF的Datasheet PDF文件第7页 
Fixed Inductors (Chip Inductors)  
4. High Power Type PF, PE, PC, PA, PB  
Features  
Low DCR and large current capability, suitable for power circuitry.  
Wire wound, resin molded chip inductor. (PC, PA, PB types)  
Unique Ceramic Core/Laser-cut technology (PF, PE type)  
Capable of being Re-flow or flow soldered.  
Wide line-up from 1005 to 4532 case sizes.  
Good for mounting.  
Recommended Applications  
AV equipment, Wireless communication equipment and various types of general electronic equipment.  
Explanation of Part Numbers  
1
2
3
4
5
6
7
8
9
10  
11  
E
L
J
P
A
1
R
5
K
F
Packaging Design No.  
Product code  
Chip Inductors  
Shape  
Inductance  
Inductance tolerance  
F
Taping  
PF 1005 (0402)  
PE 1608 (0603)  
PC 2520 (1008)  
PA 3225 (1210)  
PB 4532 (1812)  
Size : mm (inch)  
1N5  
10N  
1.5 nH  
10 nH  
D
J
0.3 nH  
5 %  
R22  
3R3  
470  
561  
220 nH  
3.3 µH  
47 µH  
K
M
10 %  
20 %  
560 µH  
Storage Conditions  
Package  
: Normal temperature (–5 to 35 °C), normal humidity (85 %RH max.), shall not be exposed to  
direct sunlight and harmful gases and care should be taken so as not to cause dew.  
Operating Temperature : –20 to +85 °C  
Storage Period  
Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation  
of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the  
passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt.  
Refer 27 and 28 page.  
Refer 29 page.  
Packaging  
Soldering Conditions  
Safety Precautions  
Refer 30 page.  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Jul. 2008  

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