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ELJ-FAR33MF PDF预览

ELJ-FAR33MF

更新时间: 2024-10-02 06:39:07
品牌 Logo 应用领域
松下 - PANASONIC /
页数 文件大小 规格书
4页 198K
描述
1 ELEMENT, 0.33uH, GENERAL PURPOSE INDUCTOR, SMD

ELJ-FAR33MF 数据手册

 浏览型号ELJ-FAR33MF的Datasheet PDF文件第2页浏览型号ELJ-FAR33MF的Datasheet PDF文件第3页浏览型号ELJ-FAR33MF的Datasheet PDF文件第4页 
Fixed Inductors (Chip Inductors)  
3. General use FC, FA, FB  
Features  
General use wire wound, resin molded chip inductor.  
Capable of being Re-flow or flow soldered.  
Wide line-up from 2520 to 4532 case sizes.  
Good for mounting.  
Recommended Applications  
AV equipment, Wireless communication equipment and various types of general electronic equipment.  
Explanation of Part Numbers  
1
2
3
4
5
6
7
8
9
10  
11  
E
L
J
F
A
1
R
2
K
F
2
Packaging Design No.  
Product code  
Chip Inductors  
Shape  
Inductance  
Inductance tolerance  
F
Taping  
FC 2520 (1008)  
FA 3225 (1210)  
FB 4532 (1812)  
Size : mm (inch)  
R22  
3R3  
470  
561  
220 nH  
3.3 µH  
47 µH  
J
5 %  
K
M
10 %  
20 %  
560 µH  
102 1000 µH  
Storage Conditions  
Package  
: Normal temperature (–5 to 35 °C), normal humidity (85 %RH max.), shall not be exposed to  
direct sunlight and harmful gases and care should be taken so as not to cause dew.  
Operating Temperature : –20 to +85 °C  
Storage Period  
Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation  
of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the  
passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt.  
Refer 28 ro 29 page.  
Refer 30 page.  
Packaging  
Soldering Conditions  
Safety Precautions  
Refer 31 page.  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Dec. 2007  

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