LED - Chip
ELС-940-11
Preliminary
10.04.2007
Technology
rev. 03/06
Type
DH
Electrodes
Radiation
Infrared
AlGaAs/GaAs
P (anode) up
1000
typ. dimensions (µm)
typ. thickness
260 (±20) µm
cathode
gold alloy, 0.5 µm
anode
gold alloy, 1.5 µm
PoC-05
Optical and Electrical Characteristics
Tamb = 25°C, unless otherwise specified
Test
Parameter
Symbol
VF
Min
Typ
Max
Unit
conditions
IF = 20 mA
IF = 350 mA
IR = 10 µA
IF = 20 mA
IF = 350 mA
IF = 20 mA
IF = 20 mA
IF = 20 mA
Forward voltage
1.2
1.6
1.3
1.8
V
V
Forward voltage2
Reverse voltage
VF
VR
5
V
Radiant power1
Radiant power2
Φe
0.8
17
1.5
22
mW
mW
nm
nm
ns
Φe
λP
Peak wavelength
Spectral bandwidth at 50%
Switching time
930
940
45
950
∆λ0.5
tr, tf
600
1Measured on bare chip on TO-18 header with EPIGAP equipment
2Measured on bare chip glued on a Ø 8 x 1mm Cu header (10 s after switched on) with EPIGAP
equipment (for information only)
Labeling
Lot N°
VF(typ) [V]
Quantity
Φe(typ) [mW]
Type
ELС-940-11
Packing: Chips on adhesive film with wire-bond side on top
EPIGAP Optoelektronik GmbH, D-12555 Berlin, Köpenicker Str.325 b, Haus 201
1 of 1
Tel.: +49-30-6576 2543, Fax : +49-30-6576 2545