E/H (T-Level) (Military M/D55342)
www.vishay.com
Vishay Dale Thin Film
DIMENSIONS in inches
D
W
T
E
L
CASE SIZE
M55342X01
M55342X02
M55342X03
M55342X04
M55342X05
M55342X06
D55342X07
M55342X08
M55342X09
M55342X10
M55342X11
M55342X12
TERM.
L
W
T
D
0.010
E
B
B
B
B
B
B
B
B
B
B
B
B
0.055 0.006
0.055 0.006
0.105 0.007
0.155 0.007
0.230 0.007
0.080 0.006
0.126 0.008
0.209 0.009
0.259 + 0.009 / - 0.015
0.105 0.007
0.042 0.008
0.064 0.006
0.025 0.005
0.050 0.005
0.050 0.005
0.050 0.005
0.075 0.005
0.050 0.005
0.063 0.005
0.098 0.005
0.124 0.005
0.100 0.005
0.022 0.005
0.032 0.005
0.010 to 0.033
0.010 to 0.033
0.010 to 0.033
0.015 to 0.033
0.010 to 0.033
0.010 to 0.033
0.010 to 0.033
0.010 to 0.033
0.010 to 0.033
0.010 to 0.033
0.010 to 0.033
0.010 to 0.033
0.015
0.015
0.015
0.015
0.020
0.015
0.010
0.015
0.015
0.020
0.016 0.008
0.020 + 0.005 / - 0.010
0.020
0.020
0.015
0.010
0.012
0.020
0.020
0.015
0.010
0.015
ENVIRONMENTAL TESTS
MIL-PRF-55342 LIMITS
(ΔR
VISHAY PERFORMANCE
(ΔR
ENVIRONMENTAL TEST
)
)
Thermal Shock
0.10 %
0.10 %
0.10 %
0.10 %
0.20 %
0.20 %
25 ppm/°C
0.05 %
2.00 %
0.02 %
0.03 %
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Moisture Resistance
TCR
0.05 %
0.01 %
0.01 %
0.04 %
< 15 ppm/°C
0.02 %
Life (2000 h at + 70 °C)
Life (10 000 h at + 70 °C)
0.04 %
MECHANICAL SPECIFICATIONS
Resistive Element
Tamelox
Alumina
Substrate Material
Chip Terminations
Solder over nickel
Fused Solder
Tin / lead solder alloy
Revision: 15-Nov-2021
Document Number: 60060
2
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000