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EBD52UC8AAFA PDF预览

EBD52UC8AAFA

更新时间: 2022-12-22 00:38:55
品牌 Logo 应用领域
尔必达 - ELPIDA 动态存储器双倍数据速率
页数 文件大小 规格书
18页 180K
描述
512MB Unbuffered DDR SDRAM DIMM

EBD52UC8AAFA 数据手册

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EBD52UC8AAFA  
Serial PD Matrix  
Byte No. Function described  
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value  
Comments  
128 bytes  
Number of bytes utilized by module  
0
1
1
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
80H  
08H  
manufacturer  
Total number of bytes in serial PD  
256 bytes  
device  
2
Memory type  
0
0
0
0
0
0
0
0
0
0
1
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
1
0
1
1
0
0
0
0
1
1
1
0
0
0
0
1
0
1
1
0
0
0
0
0
0
1
0
0
1
1
0
0
0
0
0
1
1
0
0
0
0
07H  
0DH  
0AH  
02H  
40H  
00H  
04H  
75H  
75H  
00H  
82H  
08H  
00H  
DDR SDRAM  
3
Number of row address  
Number of column address  
Number of DIMM ranks  
Module data width  
13  
4
10  
5
2
6
64  
7
Module data width continuation  
0
8
Voltage interface level of this assembly 0  
SSTL2  
7.5ns  
0.75ns  
None.  
7.6µs  
× 8  
9
DDR SDRAM cycle time, CL = 2.5  
SDRAM access from clock (tAC)  
DIMM configuration type  
Refresh rate/type  
0
0
0
1
0
0
10  
11  
12  
13  
14  
Primary SDRAM width  
Error checking SDRAM width  
None.  
SDRAM device attributes:  
Minimum clock delay back-to-back  
column access  
15  
0
0
0
0
0
0
0
1
01H  
1 CLK  
SDRAM device attributes:  
16  
17  
18  
19  
20  
21  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
1
0
0
0
1
1
1
0
0
0
1
0
0
0
1
0
0
0
0
1
0
0
0EH  
04H  
0CH  
01H  
02H  
20H  
2,4,8  
Burst length supported  
SDRAM device attributes: Number of  
banks on SDRAM device  
SDRAM device attributes:  
/CAS latency  
SDRAM device attributes:  
/CS latency  
SDRAM device attributes:  
/WE latency  
4
2, 2.5  
0
1
Differential  
Clock  
SDRAM module attributes  
22  
23  
SDRAM device attributes: General  
Minimum clock cycle time at CL = 2  
1
1
1
0
0
1
0
0
0
0
0
0
0
0
0
0
C0H  
A0H  
VDD ± 0.2V  
10ns  
Maximum data access time (tAC) from  
clock at CL = 2  
24  
0
1
1
1
0
1
0
1
75H  
0.75ns  
25 to 26  
27  
0
0
0
1
0
0
0
1
0
0
0
0
0
0
0
0
00H  
50H  
Minimum row precharge time (tRP)  
20ns  
Minimum row active to row active  
delay (tRRD)  
Minimum /RAS to /CAS delay (tRCD)  
Minimum active to precharge time  
(tRAS)  
Module rank density  
28  
29  
30  
31  
32  
0
0
0
0
1
0
1
0
1
0
1
0
1
0
0
1
1
0
0
1
1
0
1
0
0
1
0
1
0
0
0
0
0
0
0
0
0
1
0
0
3CH  
50H  
2DH  
40H  
90H  
15ns  
20ns  
45ns  
256M bytes  
0.9ns*1  
Address and command setup time  
before clock (tIS)  
Address and command hold time after  
clock (tIH)  
33  
1
0
0
1
0
0
0
0
90H  
0.9ns*1  
Data Sheet E0362E20 (Ver. 2.0)  
5

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