PART NUMBERING GUIDE
EB52E8 C 2 V - 13.000M TR
OPERATING TEMPERATURE RANGE
C=-20°C to 70°C
E=-40°C to 85°C
PACKAGING OPTIONS
Blank=Bulk
TR=Tape and Reel
FREQUENCY STABILITY
2 = 0.5ppm Maximum
3 = 1.0ppm Maximum
4 = 1.5ppm Maximum
5 = 2.0ppm Maximum
6 = 2.5ppm Maximum
FREQUENCY
EXTERNAL TRIM
N=None (No Connection on Pad 10)
V=Voltage Control
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
2.00
MAX
ꢀ.00 0.ꢀ0 (x5)
0.80 0.ꢀ0 (x4)
2.54
ꢀ.4 (x4)
5.00
0.ꢀ0
0.40
0.ꢀ0
5
4
Pin 1-3: Do Not Connect
Pin 4: Ground
Pin 5: Output
Pin 6-7: Do Not Connect
Pin 8: Tri-State
Pin 9: Supply Voltage
Pin 10: No Connect or
Voltage Control
ꢀ.00
3
2
6
ꢀ.3
ꢀ.8
0.ꢀ0
ꢀ.4
ꢀ.0
7.00
0.ꢀ0
(x4)
6.0
7
8
ꢀ
ꢀ.27
0.ꢀ0
(x4)
0.60
ꢀ0
9
0.ꢀ0
(x6)
2.54
0.ꢀ0
(x2)
0.80
0.ꢀ0
ꢀ.2 (x4)
Solder Land (x5)
Tolerances= +0.1
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
M
N
O
P
Q
REEL
A
B
C
D
E
F
TAPE
1.5 MIN
50 MIN
20.2 MIN 13.0 0.2
40 MIN
16.0 0.2
7.5 0.1
6.75 0.1 4.0 0.1
2.0 0.1
R
S
T
U
V
QTY/REEL
1,000
F
G
H
J
K
L
K0*
2.5 MIN
10 MIN
22.4 MAX 360 MAX
16.4+2-0
8.0 0.1
B0* 1.5 +0.1-0.0
A0* 0.32 0.05
*Compliant to EIA 481A
MARKING SPECIFICATIONS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
Characteristic
Specification
Fine Leak Test
Gross Leak Test
Mechanical Shock
Vibration
Solderability
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-202, Method 213, Condition C
MIL-STD-883, Method 2007, Condition A
MIL-STD-883, Method 2003
Line 1: E XX.XXX
Frequency in MHz (5 Digits Maximum + Decimal)
Temperature Cycling
Resistance to Soldering Heat
Resistance to Solvents
MIL-STD-883, Method 1010
MIL-STD-202, Method 210
MIL-STD-202, Method 215
Line 2: XX Y ZZ
Week of Year
Last Digit of Year
Ecliptek Manufacturing Identifier
MANUFACTURER
CATEGORY
SERIES
PACKAGE
VOLTAGE
CLASS
REV.DATE
ECLIPTEK CORP.
OSCILLATOR
EB52E8
CERAMIC
3.3V
OS5P
04/07
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.