Datasheet > DS15BR400_07

DS15BR400_07

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
美国国家半导体 - NSC		中继器
页数	文件大小	规格书
14页	316K
描述
4-Channel LVDS Buffer/Repeater with Pre-Emphasis

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数据手册

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DS15BR400_07 数据手册

Pin Descriptions

Name

TQFP Pin

Number

LLP Pin

Number

I/O, Type

Description

DIFFERENTIAL INPUTS

IN0+

IN0−

I, LVDS

Channel 0 inverting and non-inverting differential inputs.

Channel 1 inverting and non-inverting differential inputs.

Channel 2 inverting and non-inverting differential inputs.

Channel 3 inverting and non-inverting differential inputs.

IN1+

IN1−

IN2+

IN2−

IN3+

IN3−

DIFFERENTIAL OUTPUTS

OUT0+

OUT0−

O, LVDS Channel 0 inverting and non-inverting differential outputs. (Note 2)

O, LVDS Channel 1 inverting and non-inverting differential outputs. (Note 2)

O, LVDS Channel 2 inverting and non-inverting differential outputs. (Note 2)

O, LVDS Channel 3 inverting and non-inverting differential outputs. (Note 2)

OUT1+

OUT1−

OUT2+

OUT2−

OUT3+

OUT3-

DIGITAL CONTROL INTERFACE

PWDN

PEM

I, LVTTL A logic low at PWDN activates the hardware power down mode (all channels).

I, LVTTL Pre-emphasis Control Input (affects all Channels)

POWER

V_DD

3, 4, 5, 7, 10, 11, 3, 4, 6, 7, 20, I, Power V_DD= 3.3V, ±10%

28, 29, 32, 33 21

GND

N/C

8, 9, 17, 18, 23, 5 (Note 1)

24, 37, 38, 43,

I, Ground Ground reference for LVDS and CMOS circuitry. For the LLP package, the DAP

is used as the primary GND connection to the device in addition to the pin

numbers listed. The DAP is the exposed metal contact at the bottom of the

LLP-32 package. It should be connected to the ground plane with at least 4

vias for optimal AC and thermal performance.

1,6, 25, 26, 27,

30, 31, 34, 35, 18,19,22, 23,

36 24

1, 17,

No Connect

Note 1: Note that for the LLP package the GND is connected thru the DAP on the back side of the LLP package in addition to the actual pin numbers listed.

Note 2: The LVDS outputs do not support a multidrop (BLVDS) environment. The LVDS output characteristics of the DS15BR400 and DS15BR401 are optimized

for point-to-point backplane and cable applications.

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