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DF37B-44DP-0.4V(75) PDF预览

DF37B-44DP-0.4V(75)

更新时间: 2024-09-29 21:10:59
品牌 Logo 应用领域
广濑 - HRS 连接器
页数 文件大小 规格书
12页 867K
描述
Board Stacking Connector

DF37B-44DP-0.4V(75) 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8536.69.40.40风险等级:5.75
连接器类型:BOARD STACKING CONNECTOR联系完成配合:NOT SPECIFIED
联系完成终止:Gold (Au)触点材料:NOT SPECIFIED
JESD-609代码:e4Base Number Matches:1

DF37B-44DP-0.4V(75) 数据手册

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0.4mm Pitch, 0.98/1.5mm Mated Height, Board-to-Board / Board-to-FPC Connectors  
DF37 Series  
Further reduction of the board space.  
Comparison of board mounting space  
30 positions, 0.4 mm pitch, 0.98 mm height  
DF30  
DF37  
8.22mm  
Fig.1  
Features  
Header  
1. Reduced size and board-occupied area  
With the mated height of 0.98/1.5mm, width of  
2.98mm and length of 8.22mm (30 positions) the  
connectors are one of the smallest in its class. Also  
2.6mm depth short-lead type is available. (Fig.1)  
Sufficiently large flat areas allow pick-up with  
vacuum nozzles of automatic placement  
equipment.  
Receptacle  
Lock  
2. Reliable electrical and mechanical  
Fig.2  
connection  
Despite its small mated height, unique contact  
configuration, with a 2-point contacts and effective  
mating length of 0.25mm, assures highly reliable  
connection while confirming a complete mating with  
a definite tactile feel.  
Splatter protection  
Contact areas  
3. Self alignment  
Recognizing the difficulties of mating extremely small  
connectors in limited spaces, the connectors will self-  
align within 0.3mm.  
4. Physical shock and vibration protection  
2-point contact assures electrical connection in a  
shock or vibration applications. (Fig.2)  
Contact areas are not exposed to the outside  
penetration of the flux or other physical particles.  
5. Solder wicking prevention  
Nickel barriers (receptacles) and unique forming of the  
contacts (headers) prevent un-intentional solder  
wicking.  
Contact areas  
6. Contamination protection  
Insulator walls protect the contact areas against flux  
splatter or other physical particles contamination. (Fig.3)  
Fig.3  
1
2016.8  

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