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DF1EG-2P-2.5DSA(35) PDF预览

DF1EG-2P-2.5DSA(35)

更新时间： 2024-10-01 18:09:11
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广濑 - HRS 连接器
页数 文件大小 规格书
1页 67K
描述
连接器类型:插头;线束品:无;安全规格:C-UL/CSA, UL;PIN数:2;额定电流:3.0 A;(AC)额定电压:AC 250.0 V;(DC)额定电压:DC 250.0 V;(嵌合部分)列

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DF1EG-2P-2.5DSA(35) 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：ActiveReach Compliance Code：unknown
风险等级：1.7连接器类型：BOARD CONNECTOR
联系完成配合：NOT SPECIFIED联系完成终止：Tin (Sn)
触点材料：NOT SPECIFIEDJESD-609代码：e3
Base Number Matches：1

DF1EG-2P-2.5DSA(35) 数据手册

  
Applicable standard  
Operating  
Storage  
-35 C to +85 C(Note1)  
40% to 80% (Note2)  
-10 C to +60 C(Note3)  
40% to 70% (Note3)  
temperature range  
Operating  
humidity range  
temperature range  
Storage  
humidity range  
Applicable connector  
Rating  
Voltage  
Current  
250 V AC  
AWG20 to 24: 3A  
AWG26: 2A  
DF1E-*S-2.5C  
Voltage  
AC 30V  
AWG20 to 22: 3A  
AWG24 to 28: 1A  
AWG30: 0.5A  
UL,CSA  
AWG28: 1A  
AWG30: 0.5A  
Current  
Specifications  
Test method  
Item  
Requirements  
QT AT  
Construction  
General examination  
Visually and by measuring instrument.  
Confirmed visually.  
According to drawing.  
X
X
X
X
Marking  
Electric characteristics  
Contact resistance millivolt  
20 mV MAX, 1 mA(DC or 1000 Hz).  
30 mMAX.  
X
－
level method.  
Insulation resistance  
500 V DC.  
1000 MMIN.  
X
X
－
－
Voltage proof  
650 V AC for 1 min.  
No flashover or breakdown.  
Mechanical characteristics  
Mechanical operation  
30times insertions and extractions.  
① Contact resistance: 30 mMAX.  
② No damage, crack or looseness of parts.  
X
X
X
－
－
－
Vibration  
Shock  
Frequency 10 to 55 Hz, single amplitude  
0.75 mm, at 2 h, for 3 directions.  
490 m/s2 duration of pulse 11 ms at 3 times for 3  
directions.  
① No electrical discontinuity of 1 s.  
② No damage, crack or looseness of parts.  
Environmental characteristics  
Rapid change of  
temperature  
Temperature -55→ 5 to 35→+85→ 5 to 35 c  
Time 30→ 5 max→ 30→ 5 max min  
① Contact resistance: 30 mMAX.  
② Insulation resistance: 1000 MMIN.  
③No damage, crack or looseness of parts.  
X
X
X
－
－
－
Under 5 cycles.  
Damp heat  
(Steady state)  
Exposed at 40 ± 2 c, 90 to 95 , 96 h.  
① Contact resistance: 30 mMAX.  
② Insulation resistance: 500 MMIN.  
③No damage, crack or looseness of parts.  
No deformation of case of excessive  
looseness of the terminals.  
Resistance to soldering  
heat  
1) Automatic soldering （flow）  
Solder temperature,  
260 ℃  
for  
Immersion,duration, 10 sec.  
2) Manual soldering  
Soldering iron temperature : 300 ℃,  
Soldering time : 3 sec.  
No strength on contact.  
Solderability  
Remarks  
Soldered at solder temperature,  
Solder shall cover a minimum of  
95 of the surface being immersed.  
X
235 c for insertion duration,  
5
s.  
－
Note1: Include the temperature rising by current.  
Note2:No condensing.  
Note3:Apply to the condition of long term storage for unused products before pcb on board.  
After pcb board,operating temperature and humidity range is applied for interim storage during transportation.  
Count  
Description of revisions  
Designed  
Checked  
Date  
0
△
Approved  
Checked  
Designed  
Drawn  
KI.AKIYAMA  
KI.AKIYAMA  
TS.KUMAZAWA  
MI.SAKIMURA  
15.06.16  
15.06.16  
15.06.15  
15.06.15  
TO  
Unless otherwise specified, refer to IEC 60512.  
Note QT:Qualification Test AT:Assurance Test X:Applicable Test  
Drawing no.  
ELC-336779-35-00  
Part no.  
DF1EG-*P-2.5DSA(35)  
CL541  
Specification sheet  
Hirose electric co., ltd.  
0
△
1/1  
Code no.  
FORM HD0011-2-1  
1

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