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DAC811BH-BI

更新时间: 2024-02-02 05:20:50
品牌 Logo 应用领域
BB 转换器微处理器
页数 文件大小 规格书
9页 98K
描述
D/A Converter, 12-Bit, 1 Func, Bipolar, CDIP28,

DAC811BH-BI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:DIP, DIP28,.6Reach Compliance Code:unknown
风险等级:5.89转换器类型:D/A CONVERTER
输入位码:BINARY, OFFSET BINARYJESD-30 代码:R-XDIP-T28
JESD-609代码:e0最大线性误差 (EL):0.006%
位数:12功能数量:1
端子数量:28最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:CERAMIC
封装代码:DIP封装等效代码:DIP28,.6
封装形状:RECTANGULAR封装形式:IN-LINE
电源:5,+-12/+-15 V最大稳定时间:4 µs
子类别:Other Converters最大压摆率:75 mA
表面贴装:NO技术:BIPOLAR
温度等级:MILITARY端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL

DAC811BH-BI 数据手册

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PIN DESCRIPTIONS  
ABSOLUTE MAXIMUM RATINGS  
PIN NAME  
FUNCTION  
+VCC ................................................................................................................................ 0 to +18V  
–VCC to ACOM .......................................................................... 0 to –18V  
VDD to DCOM .............................................................................. 0 to +7V  
VDD to ACOM ...................................................................................... ±7V  
ACOM to DCOM.................................................................................. ±7V  
Digital Inputs (Pins 2–14, 16–19) to DCOM ...................... –0.4V to +18V  
External Voltage Applied to 10V Range Resistor ............................ ±12V  
Ref Out ............................................................. Indefinite Short to ACOM  
External Voltage Applied to DAC Output................................ –5V to +5V  
Power Dissipation ........................................................................ 1000mW  
Lead Temperature (soldering, 10s)............................................... +300°C  
Max Junction Temperature............................................................ +165°C  
Thermal Resistance, θJ-A: Plastic DIP and SOIC ....................... 100°C/W  
Ceramic DIP .................................................................................. 65°C/W  
1
2
+VDD  
WR  
Logic supply, +5V.  
Write, command signal to load latches. Logic low  
loads latches.  
3
4
5
6
LDAC  
NA  
Load D/A converter, enables WR to load the D/A  
latch. Logic low enables.  
Nibble A, enables WR to load input latch A (the  
most significant nibble). Logic low enables.  
NB  
Nibble B, enables WR to load input latch B. Logic  
low enables.  
NC  
Nibble C, enables WR to load input latch C (the  
least significant nibble). Logic low enables.  
7
D11  
Data bit 12, MSB, positive true.  
Data bit 11.  
NOTE: Stresses above those listed above may cause permanent damage to  
the device. Exposure to absolute maximum conditions for extended periods  
may affect device reliability.  
8
D10  
9
D9  
Data bit 10.  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
D8  
Data bit 9.  
D7  
Data bit 8.  
D6  
Data bit 7.  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
This integrated circuit can be damaged by ESD. Burr-Brown  
recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling  
and installation procedures can cause damage.  
D5  
Data bit 6.  
D4  
Data bit 5.  
DCOM  
D0  
Digital common, VDD supply return.  
Data bit 1, LSB.  
D1  
Data bit 2.  
D2  
Data bit 3.  
D3  
Data bit 4.  
+VCC  
–VCC  
Gain Adj  
ACOM  
VOUT  
Analog supply input, +15V or +12V.  
Analog supply input, –15V or –12V.  
To externally adjust gain.  
Analog common, ±VCC supply return.  
D/A converter voltage output.  
ESD damage can range from subtle performance degradation  
to complete device failure. Precision integrated circuits may  
be more susceptible to damage because very small parametric  
changes could cause the device not to meet its published  
specifications.  
10V Range Connect to pin 24 for 10V range.  
SJ  
Summing junction of output amplifier.  
BPO  
Bipolar offset. Connect to pin 26 for bipolar  
operation.  
28  
Ref Out  
6.3V reference output.  
PACKAGE/ORDERING INFORMATION  
MINIMUM  
RELATIVE  
ACCURACY  
(LSB)  
DIFFERENTIAL  
LINEARITY  
(LSB)  
PACKAGE  
DRAWING  
NUMBER  
SPECIFICATION  
TEMPERATURE  
RANGE  
ORDERING  
NUMBER(1)  
TRANSPORT  
MEDIA  
PRODUCT  
PACKAGE  
DAC811AH  
DAC811JP  
DAC811JU  
±1/2 LSB  
±1/2 LSB  
±1/2 LSB  
3/4  
3/4  
3/4  
CerDIP-28  
DIP-28  
149  
215  
217  
–25°C to +85°C  
0°C to +70°C  
0°C to +70°C  
DAC811AH  
DAC811JP  
DAC811JU  
Rails  
Rails  
Rails  
SOIC-28  
"
"
"
1/2  
1/2  
"
"
215  
217  
"
DAC811JU/1K  
DAC811KP  
DAC811KU  
Tape and Reel  
Rails  
DAC811KP  
±1/4 LSB  
DIP-28  
0°C to +70°C  
DAC811KU  
±1/4 LSB  
SOIC-28  
0°C to +70°C  
Rails  
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces  
of “DAC811JU/1K” will get a single 1000-piece Tape and Reel.  
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes  
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change  
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant  
any BURR-BROWN product for use in life support devices and/or systems.  
®
3
DAC811  

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