DAC08
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
1
Rating
Package Type
θJA
θJC
16
39
36
35
Unit
°CꢀW
°CꢀW
°CꢀW
°CꢀW
Operating Temperature
DAC08AQ, DAC08Q
DAC08HQ, DAC08EQ, DAC08CQ,
DAC08HP, DAC08EP
16-Lead CERDIP (Q)
16-Lead PDIP (P)
20-Terminal LCC (RC)
16-Lead SOIC (S)
100
82
76
−55°C to +125°C
0°C to +70°C
111
DAC08CP, DAC08CS
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
−65°C to +125°C
300°C
36 V
V− to V− + 36 V
V− to V+
Junction Temperature (TJ)
Storage Temperature Q Package
Storage Temperature P Package
Lead Temperature (Soldering, 60 sec)
V+ Supply to V− Supply
Logic Inputs
1 θJA is specified for worst-case mounting conditions, that is, θJA is specified for
device in socket for CERDIP, PDIP, and LCC packages; θJA is specified for
device soldered to printed circuit board for SOIC package.
Stresses greater than those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
VLC
Analog Current Outputs (at VS− = 15 V)
Reference Input (V14 to V15)
Reference Input Differential Voltage
(V14 to V15)
4.25 mA
V− to V+
18 V
5.0 mA
Reference Input Current (I14)
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. C | Page 5 of 20