DAC08
TABLE OF CONTENTS
Specifications..................................................................................... 3
Reference Amplifier Compensation for Multiplying
Applications ................................................................................ 13
Electrical Characteristics............................................................. 3
Typical Electrical Characteristics ............................................... ±
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Connections ............................................................................... 6
Test and Burn-In Circuits................................................................ 7
Typical Performance Characteristics ............................................. 8
Basic Connections .......................................................................... 11
Application Information................................................................ 13
Reference Amplifier Setup ........................................................ 13
Logic Inputs................................................................................. 13
Analog Output Currents ........................................................... 1±
Power Supplies............................................................................ 1±
Temperature Performance......................................................... 1±
Multiplying Operation............................................................... 1±
Settling Time............................................................................... 1±
ADI Current Output DACs........................................................... 16
Outline Dimensions....................................................................... 17
Ordering Guide .......................................................................... 18
REVISION HISTORY
11/04—Rev. B to Rev. C
Changed SO to SOIC .........................................................Universal
Removed DIE......................................................................Universal
Changes to Figure 30, Figure 31, Figure 32................................. 12
Change to Figure 33 ....................................................................... 15
Added Table ±.................................................................................. 16
Updated Outline Dimensions....................................................... 17
Changes to Ordering Guide .......................................................... 18
2/02—Rev. A to Rev. B
Edits to SPECIFICATIONS............................................................. 2
Edits to ABSOLUTE MAXIMUM RATING ................................ 3
Edits to ORDERING GUIDE.......................................................... 3
Edits to WAFER TEST LIMITS...................................................... 5
Edit to Figure 13 ............................................................................... 8
Edits to Figures 1± and 15 ............................................................... 9
Rev. C | Page 2 of 20
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