Datasheet > CZRM27C10P

CZRM27C10P

更新时间： 2024-01-08 08:50:43

品牌	Logo	应用领域
上华 - COMCHIP		稳压二极管
页数	文件大小	规格书
3页	89K
描述
Surface Mount Zener Diode

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CZRM27C10P 数据手册

COMCHIP

Surface Mount Zener Diode

www.comchiptech.com

CZRM27C3V6P THRU C200P

Features

Power Dissipation 0.8Watts

Low profile surface-mount package

MINI-SMA

Zener and surge current specification

Low leakage current

Excellent stability

(

0.161 4.1)

(

0.146 3.7)

(

0.012 0.3)Typ.

(

0.071 1.8)

(

)

0.055 1.4

Mechanical Data

Case: Molded plastic MINI-SMA

(2.8

(2.4

0.110

0.094

)

Epoxy: UL 94V-0 rate flame retardant

Solderable per MIL-STD-202,

method 208 guaranteed

(

0.063 1.6)

(

)

0.055 1.4

Polarity: cathode band

(

0.035 0.9)Typ.

(

0.035 0.9)Typ.

Mounting position: Any

Weight: 0.04gram(approx.)

Dimensions in inches and (millimeters)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Rating at 25

C ambient temperature unless otherwise specified.

Parameter

VALUE

Units

Forward voltage

IF=0.2A

1.2

Power Dissipation

TA=25^oC

TL=80^oC

( Note )

0.8

2.3

Non-repetitive peak pulse

power dissipation

TJ=25^oC

100us square pulse

300

150

100

Non-repetitive peak pulse

power dissipation

TJ=25^oC

10/1000us waveform

(CZRM27C7V5P to C100P)

Non-repetitive peak pulse

TJ=25^oC

power dissipation 10/1000us waveform

(CZRM27C110P to C200P)

Thermal resistance junction to lead

ambient ( Note )

^oC

180

Operating junction and Storage Temperature

Range

150 / -55 to +150

NOTES : Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads ( 40um thick)

MDS0310010B

Page 1

12 3

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