Chapter 1
Introduction to the TME EBK
In general terms, thermal management is a combination of temperature sensing, fan control and the
algorithms or transfer functions that map temperature to fan speed. Thermal management is a
critical, system-level function that needs to ensure that all components in the system operate within
safe temperature limits, while at the same time minimizing power consumption and acoustic noise.
Typical solutions for thermal management include multiple devices such as CPLDs, mixed-signal
ASICs and/or limited-functionality and inflexible discrete devices. Thermal management solutions
need to be flexible enough to interface with many kinds of both digital and analog temperature
sensors. To maximize efficiency, they must also be able to drive a multitude of fans independently.
Finally, thermal management solutions must have enough intelligence built in to reliably control the
cooling systems autonomously, independent of a master control processor in the event that
communications are lost or the master control processors fail or go offline.
The PSoC® 3 architecture enables a flexible and unique method of thermal management in a single
chip, combining analog sensing capabilities for any kind of analog temperature sensor such as
remote diodes, thermistors, resistance temperature detectors (RTDs), etc. PSoC 3’s versatile digital
resource pool enables the integration of multiple I2C bus interfaces, capture timers and even
full-custom logic to support interfaces to a wide variety of digital temperature sensors such as I2C
based, pulse-width-modulated (PWM) based and other proprietary serial interface digital
temperature sensors. PSoC 3’s unique CPLD-like hardware blocks are also used to implement a full
hardware closed loop fan control system for high reliability systems that require zero intervention
from firmware running on the built-in MCU or running on an external master control processor.
This frees up MCU processing power to run and manage algorithms or transfer functions of very
high complexity to optimize fan speeds to achieve system cooling requirements.
The PSoC Thermal Management Expansion Board Kit (TME EBK) is a part of the PSoC
development kit ecosystem and is designed to work with the CY8CKIT-001 PSoC Development Kit
(DVK) and CY8CKIT-030 PSoC 3 Development Kit (DVK). It enables you to evaluate a system’s
thermal management functions and capabilities of PSoC 3 devices. You can evaluate the example
projects described in this guide or design and customize your own thermal management solution
using components in Cypress’s PSoC CreatorTM software (included in this kit) or by altering
example projects provided with this kit.
The PSoC Thermal Management Expansion Board Kit (TME EBK) is used with the PSoC family of
devices and is specifically designed and packaged for use with the PSoC 3 device family. PSoC 3 is
a programmable system-on-chip platform that combines precision analog and digital logic with a
high performance, single-cycle, 67MHz 8051 processor. With the flexibility of the PSoC
architecture, you can easily create your own custom thermal management solution on chip with the
exact functionality you need, in the way you want it—no more, no less.
3
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