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CY7C4121KV13 PDF预览

CY7C4121KV13

更新时间: 2024-01-01 23:52:24
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
45页 1182K
描述
144-Mbit QDR™-IV HP SRAM

CY7C4121KV13 数据手册

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CY7C4121KV13/CY7C4141KV13  
144-Mbit QDR™-IV HP SRAM  
144-Mbit QDR™-IV HP SRAM  
Features  
Configurations  
144-Mbit density (8M × 18, 4M × 36)  
CY7C4121KV13 – 8M × 18  
CY7C4141KV13 – 4M × 36  
Total Random Transaction Rate[1] of 1334 MT/s  
Maximum operating frequency of 667 MHz  
Functional Description  
Read latency of 5.0 clock cycles and write latency of 3.0 clock  
cycles  
The QDR™-IV HP (High-Performance) SRAM is  
high-performance memory device that has been optimized to  
maximize the number of random transactions per second by the  
use of two independent bidirectional data ports.  
a
Two-word burst on all accesses  
Dual independent bidirectional data ports  
Double data rate (DDR) data ports  
Supports concurrent read/write transactions on both ports  
These ports are equipped with DDR interfaces and designated  
as port A and port B respectively. Accesses to these two data  
ports are concurrent and completely independent of each other.  
Access to each port is through a common address bus running  
at DDR. The control signals are running at SDR and determine  
if a read or write should be performed.  
Single address port used to control both data ports  
DDR address signaling  
Single data rate (SDR) control signaling  
There are three types of differential clocks:  
High-speed transceiver logic (HSTL) and stub series  
terminated logic (SSTL) compatible signaling (JESD8-16A  
compliant)  
(CK, CK#) for address and command clocking  
(DKA, DKA#, DKB, DKB#) for data input clocking  
(QKA, QKA#, QKB, QKB#) for data output clocking  
I/O VDDQ = 1.2 V ± 50 mV or 1.25 V ± 50 mV  
Pseudo open drain (POD) signaling (JESD8-24 compliant)  
I/O VDDQ = 1.1 V ± 50 mV or 1.2 V ± 50 mV  
Addresses for port A are latched on the rising edge of the input  
clock (CK), and addresses for port B are latched on the falling  
edge of the input clock (CK).  
Core voltage  
VDD = 1.3 V ±40 mV  
The QDR-IV HP SRAM device is offered in a two-word burst  
option and is available in ×18 and ×36 bus width configurations.  
On-die termination (ODT)  
For a ×18 bus width configuration, there are 22 address bits, and  
for a ×36 bus width configuration, there are 21 address bits  
respectively.  
Programmable for clock, address/command, and data inputs  
Internal self-calibration of output impedance through ZQ pin  
Bus inversion to reduce switching noise and power  
Programmable on/off for address and data  
An on-chip ECC circuitry detects and corrects all single-bit  
memory errors, including those induced by soft-error events,  
such as cosmic rays and alpha particles. The resulting SER of  
these devices is expected to be less than 0.01 FITs/Mb, a  
four-order-of-magnitude improvement over previous generation  
SRAMs.  
Address bus parity error protection  
Training sequence for per-bit deskew  
On-chip error correction code (ECC) to reduce soft error rate  
(SER)  
For a complete list of related resources, click here.  
JTAG 1149.1 test access port (JESD8-26 compliant)  
1.3-V LVCMOS signaling  
Available in 361-ball FCBGA Pb-free package (21 × 21 mm)  
Selection Guide  
QDR-IV  
1334 (MT/s)  
QDR-IV  
1266 (MT/s)  
QDR-IV  
1200 (MT/s)  
Description  
Unit  
Maximum operating frequency  
Maximum operating current  
667  
2500  
3200  
633  
2400  
2950  
600  
2300  
2700  
MHz  
mA  
× 18  
× 36  
Note  
1. Random Transaction Rate (RTR) is defined as the number of fully random memory accesses (reads or writes) that can be performed on the memory. RTR is measured  
in million transactions per second.  
Cypress Semiconductor Corporation  
Document Number: 001-79343 Rev. *Q  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised August 4, 2017  

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