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CY7C172A-35DMB PDF预览

CY7C172A-35DMB

更新时间: 2024-09-30 19:40:31
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器内存集成电路
页数 文件大小 规格书
9页 164K
描述
Standard SRAM, 4KX4, 35ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24

CY7C172A-35DMB 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIP包装说明:0.300 INCH, CERDIP-24
针数:24Reach Compliance Code:not_compliant
ECCN代码:3A001.A.2.CHTS代码:8542.32.00.41
风险等级:5.34最长访问时间:35 ns
其他特性:AUTOMATIC POWER-DOWNI/O 类型:SEPARATE
JESD-30 代码:R-GDIP-T24JESD-609代码:e0
长度:31.877 mm内存密度:16384 bit
内存集成电路类型:STANDARD SRAM内存宽度:4
功能数量:1端口数量:1
端子数量:24字数:4096 words
字数代码:4000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:4KX4输出特性:3-STATE
可输出:NO封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DIP封装等效代码:DIP24,.3
封装形状:RECTANGULAR封装形式:IN-LINE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V认证状态:Not Qualified
筛选级别:38535Q/M;38534H;883B座面最大高度:5.08 mm
最大待机电流:0.02 A最小待机电流:4.5 V
子类别:SRAMs最大压摆率:0.07 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:MILITARY
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7.62 mm
Base Number Matches:1

CY7C172A-35DMB 数据手册

 浏览型号CY7C172A-35DMB的Datasheet PDF文件第2页浏览型号CY7C172A-35DMB的Datasheet PDF文件第3页浏览型号CY7C172A-35DMB的Datasheet PDF文件第4页浏览型号CY7C172A-35DMB的Datasheet PDF文件第5页浏览型号CY7C172A-35DMB的Datasheet PDF文件第6页浏览型号CY7C172A-35DMB的Datasheet PDF文件第7页 
CY7C171A  
CY7C172A  
4K x 4 Static RAM  
with Separate I/O  
Features  
Functional Description  
Automatic power-down when deselected  
• CMOS for optimum speed/power  
High speed  
The CY7C171A and CY7C172A are high-performance CMOS  
static RAMs organized as 4096 by 4 bits with separate I/O.  
Easy memory expansion is provided by an active LOW chip  
enable (CE) and three-state drivers. They have an automatic  
power-down feature, reducing the power consumption by 77%  
when deselected.  
t
= 15 ns  
AA  
• Transparent write (7C171A)  
• Low active power  
Writing to the device is accomplished when the chip enable  
(CE) and write enable (WE) inputs are both LOW. Data on the  
375 mW  
four input/output pins (I through I ) is written into the memory  
0
3
• Low standby power  
— 93 mW  
location specified on the address pins (A through A ).  
0
11  
Reading the device is accomplished by taking chip enable  
(CE) LOW, while write enable (WE) remains HIGH. Under  
these conditions the contents of the memory location specified  
on the address pins will appear on the four data output pins.  
• TTL-compatible inputs and outputs  
• Capable ofwithstanding greaterthan 2001V electrostat-  
ic discharge  
The output pins remain in a high-impedance state when write  
enable (WE) is LOW (7C172A only), or chip enable is HIGH.  
A die coat is used to insure alpha immunity.  
Logic Block Diagram  
Pin Configurations  
I
0
DIP/SOJ  
Top View  
I
1
V
A
CC  
1
4
24  
23  
22  
A
3
I
2
A
5
2
3
4
5
6
A
2
A
6
A
1
I
3
A
7
21  
20  
19  
18  
17  
A
0
A
8
I
0
7C171A  
7C172A  
A
9
INPUT BUFFER  
I
1
A
10  
A
11  
7
O
O
0
A
0
8
1
I
3
9
16  
A
1
O
O
0
1
O
O
I
2
3
2
10  
11  
12  
15  
14  
13  
A
2
CE  
GND  
128 x 128  
ARRAY  
WE  
A
3
A
4
C171A–2  
O
O
2
3
A
5
A
6
POWER  
DOWN  
COLUMN  
DECODER  
CE  
WE  
7C172A  
7C171A  
C171A–1  
Selection Guide  
7C171A-15  
7C172A-15  
7C171A-20  
7C172A-20  
7C171A-25  
7C172A-25  
7C171A-35  
7C172A-35  
7C171A-45  
7C172A-45  
Maximum Access Time (ns)  
15  
20  
80  
90  
25  
70  
80  
35  
70  
70  
45  
Maximum Operating  
Current (mA)  
Commercial  
Military  
115  
70  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
November 1988 - Revised April 1995  

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