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CY74FCT162500CTPVCT PDF预览

CY74FCT162500CTPVCT

更新时间: 2024-01-14 09:43:27
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德州仪器 - TI 触发器逻辑集成电路光电二极管输出元件
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12页 301K
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CY74FCT162500CTPVCT 数据手册

 浏览型号CY74FCT162500CTPVCT的Datasheet PDF文件第3页浏览型号CY74FCT162500CTPVCT的Datasheet PDF文件第4页浏览型号CY74FCT162500CTPVCT的Datasheet PDF文件第5页浏览型号CY74FCT162500CTPVCT的Datasheet PDF文件第7页浏览型号CY74FCT162500CTPVCT的Datasheet PDF文件第8页浏览型号CY74FCT162500CTPVCT的Datasheet PDF文件第9页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
27-Sep-2007  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
74FCT162500ATPVCG4  
74FCT162500ATPVCT  
74FCT162500CTPVCG4  
74FCT162500CTPVCT  
74FCT16500CTPACTE4  
74FCT16500CTPACTG4  
74FCT16500CTPVCG4  
74FCT16500CTPVCTG4  
CY74FCT162500ATPVC  
CY74FCT162500CTPVC  
CY74FCT16500CTPACT  
CY74FCT16500CTPVC  
CY74FCT16500CTPVCT  
FCT162500ATPVCTG4  
FCT162500CTPVCTG4  
SSOP  
DL  
56  
56  
56  
56  
56  
56  
56  
56  
56  
56  
56  
56  
56  
56  
56  
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SSOP  
SSOP  
SSOP  
TSSOP  
TSSOP  
SSOP  
SSOP  
SSOP  
SSOP  
TSSOP  
SSOP  
SSOP  
SSOP  
SSOP  
DL  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DGG  
DGG  
DL  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DL  
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DL  
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DGG  
DL  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Addendum-Page 1  

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