CXA2550M

更新时间： 2024-02-23 23:01:15

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CXA2550M 数据手册

CXA2550M/N

Package Outline

Unit: mm

CXA2550N

20PIN SSOP (PLASTIC)

+ 0.2

1.25 – 0.1

6.5 ± 0.1

0.1

0.65

0.13

b=0.22 ± 0.03

0.1 ± 0.1

DETAIL B : PALLADIUM

NOTE: Dimension " " does not include mold protrusion.

0˚ to 10˚

PACKAGE STRUCTURE

DETAIL

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

EPOXY RESIN

SONY CODE

SSOP-20P-L01

PALLADIUM PLATING

COPPER ALLOY

EIAJ CODE

SSOP020-P-0044

JEDEC CODE

PACKAGE MASS

0.1g

– 15 –

Sony Corporation

1...12 13 1415

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