Datasheet > CSMC582XSC

CSMC582XSC

更新时间： 2024-01-30 07:15:48

品牌	Logo	应用领域
全宇昕 - CYSTEKEC		二极管
页数	文件大小	规格书
3页	138K
描述
3.0Amp. Surface Mount Schottky Barrier Diodes

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数据手册

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CSMC582XSC 数据手册

Spec. No. : C330SC

Issued Date : 2003.10.17

Revised Date :

CYStech Electronics Corp.

Page No. : 1/3

3.0Amp. Surface Mount Schottky Barrier Diodes

CSMC582XSC Series

Features

• For surface mounted applications.

• For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications

• Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0

• Low leakage current

• High surge capability

• High temperature soldering: 250°C/10 seconds at terminals

• Exceeds environmental standards of MIL-S-19500/228

Mechanical Data

• Case: Molded plastic, SMC/JEDEC DO-214AB.

• Terminals: Solder plated, solderable per MIL-STD-750 method 2026

• Polarity: Indicated by cathode band.

• Mounting Position : Any.

• Weight: 0.195 gram, 0.00585 ounce

Maximum Ratings and Electrical Characteristics

(Rating at 25°C ambient temperature unless otherwise specified. )

Type

Parameter

Conditions

Symbol

Units

CSMC CSMC CSMC

5820

5821

5822

Repetitive peak reverse

voltage

V_RRM

V_RMS

V_R

Maximum RMS voltage

Maximum DC blocking

voltage

Maximum instantaneous

forward voltage

Maximum average forward

rectified current

I_F=3A (Note 1)

V_F

I_O

0.475 0.500 0.525

8.3ms single half sine wave superimposed

on rated load(JEDEC method)

V_R=V_RRM,T_A=25 (Note 1)

Peak forward surge current

I_FSM

℃

Maximum DC reverse

current

I_R

℃

V_R=V_RRM,T_A=125 (Note 1)

Maximum thermal

Junction to ambient(Note 2)

R_th,_JA

55 (typ)

℃

resistance

Diode junction capacitance f=1MHz and applied 4V reverse voltage

Storage temperature

C_J

Tstg

T_J

300 (typ)

-55~+150

-55~+125

℃

Operating temperature

Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle

2.Mounted on PCB with 14mm² (0.013mm thickness) copper pad area.

CSMC582XSC

CYStek Product Specification

12 3

中文翻译

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