CSD97374Q4M
www.ti.com
SLPS382C –JANUARY 2013–REVISED JULY 2013
Synchronous Buck NexFET™ Power Stage
1
FEATURES
APPLICATIONS
23
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Over 92% System Efficiency at 15A
Max Rated Continuous Current 25A, Peak 60A
High Frequency Operation (up to 2 MHz)
High Density - SON 3.5x4.5-mm Footprint
Ultra Low Inductance Package
System Optimized PCB Footprint
Ultra Low Quiescent (ULQ) Current Mode
3.3V and 5V PWM Signal Compatible
Diode Emulation Mode with FCCM
Input Voltages up to 24V
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Ultrabook/Notebook DC/DC Converters
Multiphase Vcore and DDR Solutions
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Point-of-Load Synchronous Buck in
Networking, Telecom, and Computing Systems
ORDERING INFORMATION
Device
Package
Media
Qty
Ship
SON 3.5 × 4.5-mm
Plastic Package
13-Inch
Reel
Tape and
Reel
CSD97374Q4M
2500
Three-State PWM Input
Integrated Bootsrap Diode
Shoot Through Protection
RoHS Compliant – Lead Free Terminal Plating
Halogen Free
DESCRIPTION
The CSD97374Q4M NexFET™ Power Stage is a highly optimized design for use in a high power, high density
Synchronous Buck converter. This product integrates the driver IC and NexFET technology to complete the
power stage switching function. The driver IC has a built-in selectable diode emulation function that enables
DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables
Connected Standby for Windows™ 8 . With the PWM input in tri-state, quiescent current is reduced to 130 µA,
with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is
required to resume switching). This combination produces a high current, high efficiency, and high speed
switching device in a small 3.5 × 4.5-mm outline package. In addition, the PCB footprint has been optimized to
help reduce design time and simplify the completion of the overall system design.
100
90
80
70
60
50
40
12
10
8
VGS = 5V
VIN = 12V
VOUT = 1.8V
LOUT = .29µH
fSW = 500kHz
TA = 25ºC
6
4
2
0
0
5
10
15
20
25
Output Current (A)
G001
Figure 1. Application Diagram
Figure 2. Efficiency and Power Loss
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NexFET is a trademark of Texas Instruments.
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All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated