Datasheet > CPZ58X-1N4625

CPZ58X-1N4625

更新时间： 2023-12-06 20:01:25

品牌	Logo	应用领域
CENTRAL		/
页数	文件大小	规格书
4页	496K
描述
5.1V,250mW Bare die,12.990 X 12.990 mils,Diode-Zener

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CPZ58X-1N4625 数据手册

BARE DIE PACKING OPTIONS

BARE DIE IN TRAY (WAFFLE) PACK

CT: Singulated die in tray (waffle) pack.

(example: CP211-PART NUMBER-CT)

CM: Singulated die in tray (waffle) pack 100% visually inspected as

per MIL-STD-750, (method 2072 transistors, method 2073 diodes).

(example: CP211-PART NUMBER-CM)

UNSAWN WAFER

WN: Full wafer, unsawn, 100% tested with reject die inked.

(example: CP211-PART NUMBER-WN)

SAWN WAFER ON PLASTIC RING

WR: Full wafer, sawn and mounted on plastic ring,

100% tested with reject die inked.

(example: CP211-PART NUMBER-WR)

Please note: Sawn Wafer on Metal Frame (WS)

is possible as a special order. Please contact your

Central Sales Representative at 631-435-1110.

Visit the Central website for a complete listing of specifications:

www.centralsemi.com/bdspecs

R2 (3-April 2017)

www.centralsemi.com

1 234

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型号	品牌	描述	获取价格	数据表
CPZ58X-1N4626	CENTRAL	5.6V,250mW Bare die,12.990 X 12.990 mils,Diode-Zener	获取价格
CPZ58X-1N4627	CENTRAL	6.2V,250mW Bare die,12.990 X 12.990 mils,Diode-Zener	获取价格
CPZ58X-1N5225B	CENTRAL	3V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener	获取价格
CPZ58X-1N5227B	CENTRAL	3.6V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener	获取价格
CPZ58X-1N5228B	CENTRAL	3.9V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener	获取价格
CPZ58X-1N5229B	CENTRAL	4.3V,500mW Bare die,12.990 X 12.990 mils,Diode-Zener	获取价格