Datasheet > CP701

CP701

更新时间： 2024-09-30 03:26:23

品牌	Logo	应用领域
CENTRAL		晶体晶体管
页数	文件大小	规格书
1页	68K
描述
Small Signal Transistors PNP - High Voltage Transistor Chip

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CP701 数据手册

PROCESS CP701

Small Signal Transistors

PNP - High Voltage Transistor Chip

PROCESS DETAILS

Process

Die Size

EPITAXIAL PLANAR

26 x 26 MILS

9.0 MILS

Die Thickness

Base Bonding Pad Area

Emitter Bonding Pad Area

Top Side Metalization

Back Side Metalization

6.1 x 4.9 MILS

5.2 x 5.2 MILS

Al - 30,000Å

Au - 18,000Å

GEOMETRY

GROSS DIE PER 4 INCH WAFER

16,880

PRINCIPAL DEVICE TYPES

CMPT6520

CMPTA92

CXTA92

CZTA92

MPSA92

BACKSIDE COLLECTOR

145 Adams Avenue

Hauppauge, NY 11788 USA

Tel: (631) 435-1110

Fax: (631) 435-1824

www.centralsemi.com

R1 (27- November 2001)

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