Datasheet > CM201212_MDS

CM201212_MDS

更新时间： 2024-09-30 12:55:47

品牌	Logo	应用领域
伯恩斯 - BOURNS		/
页数	文件大小	规格书
2页	101K
描述
CM201212 Series Wirewound Chip Inductor

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CM201212_MDS 数据手册

MATERIAL DECLARATION SHEET

Material

Product Line

Date

CM201212 Series

Wirewound Chip Inductor

27-April-2006

Construction

Element

Material

Weight (g)

CAS

If applicable

Average

Mass (%)

Sum

(%)

No.

Material Group

Bobbin

Material

Remark

Core

0.004

Polyester Resin

Glass

Teflon

Carbon Black

60068-52-0

65997-17-3

9002-84-0

1333-86-4

0.5

100

RoHS exempted: High-melting

point solder

Solder

Internal

Connection

0.0005

Tin

Lead

7440-31-5

7439-92-1

14.5

85.5

100

Pad

Terminal

Electrode

Terminal

Solder

0.0015

0.0005

Phosphor Bronze

100

Solder Plate

Tin

7440-31-5

99.3

Copper

Polyurethane Resin

Epoxy Resin

Phenol Novolac

Antimony Trichloride

Brominated epoxy

Fused Silica

7439-92-1

7440-50-8

29690-82-2

9003-35-4

1309-64-4

40039-93-8

60676-86-0

0.7

Wire

Coated Wire

Resin

0.0005

0.003

100

Coating

Total Weight

0.010

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www.bourns.com

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