CF5073 series
PAD LAYOUT
(Unit: µm)
XTN
XT
6
(1240,1400)
7
VC
1
VDD
Q
5
HA5073
2
INHN
(0,0)
4
3
VSS
Chip size: 1.24 × 1.4mm
Chip thickness: 300 30ꢀm
Chip base: V potential
DD
PAD DESCRIPTION AND DIMENSIONS
Pad dimensions [µm]
Pad No.
Name
I/O
Description
Function
X
Y
Oscillation frequency control Positive polarity (frequency increases with
increasing voltage)
1
VC
I
134
915
voltage input pin
Output state control voltage
input pin
High-impedance output when LOW, pull-up
resistor built-in
2
3
4
INHN
VSS
Q
I
137
458
295
137
155
–
(−) supply pin
Output frequency determined by internal
circuit to one of f , f /2, f /4, f /8, f /16, f /32
O
Output pin
1086
O
O
O
O
O
O
5
6
7
VDD
XT
–
I
(+) supply pin
1106
829
772
1263
1260
Amplifier input pin
Amplifier output pin
Crystal connection pins.
Crystal is connected between XT and XTN.
XTN
O
416
NIPPON PRECISION CIRCUITS INC.—2