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CC453232 PDF预览

CC453232

更新时间: 2022-05-09 04:18:57
品牌 Logo 应用领域
伯恩斯 - BOURNS /
页数 文件大小 规格书
2页 240K
描述
Wirewound Chip Inductor

CC453232 数据手册

 浏览型号CC453232的Datasheet PDF文件第1页 
CC453232 Series - Wirewound Chip Inductor  
Solder Reflow Profile  
Temperature  
Rising Area  
Preheat Area  
Reflow Area  
2 ~ 4 °C/sec.  
Forced Cooling Area  
3 ~ 5 °C/sec.  
2 ~ 4 °C/sec.  
150 ~ 180 °C / 90 - 150 sec.  
250  
200  
150  
100  
50  
240 5 °C  
10 sec.  
30 sec.max.  
(20~30 sec.)  
50  
100  
150  
200  
250  
0
Time (Seconds)  
Peak Temperature: 245 ° max.  
Maximum Time Above 225 °C: 30 seconds  
Maximum Time Above 200 °C: 50 seconds  
Packaging Specifications  
2.0 0.5  
(.079 .020)  
178  
(7.008)  
DIA.  
16.5  
(.650)  
MM  
(INCHES)  
DIMENSIONS:  
COVER  
TAPE  
13.0  
(.512)  
DIA.  
21.0 0.8  
(.827 .031)  
EMBOSSED  
CAVITY  
50.0 -0  
(1.97 -0)  
13.0  
(.512)  
DIA.  
EMBOSSED  
CARRIER  
12.0  
(.472)  
14.0 +0  
(0.551 +0)  
8
4
(.315)  
(.157)  
END  
START  
NO COMPONENT  
200  
(7.87)  
MIN.  
NO COMPONENT  
400  
(15.75)  
MIN.  
COMPONENTS  
USER DIRECTION OF FEED  
QTY: 500 PCS. PER REEL  
REV. 09/12  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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