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CC2520WB PDF预览

CC2520WB

更新时间: 2024-02-04 06:49:10
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
2页 175K
描述
Low Resistance Precision Chip Resistors

CC2520WB 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:, 2520
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.73其他特性:PRECISION
JESD-609代码:e1安装特点:SURFACE MOUNT
端子数量:2最高工作温度:150 °C
最低工作温度:-55 °C封装形状:RECTANGULAR PACKAGE
包装方法:TAPE; TR, 7 INCH额定温度:70 °C
电阻器类型:FIXED RESISTOR尺寸代码:2520
表面贴装:YES端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形状:ONE SURFACEBase Number Matches:1

CC2520WB 数据手册

 浏览型号CC2520WB的Datasheet PDF文件第2页 
Type CC Low Resistance Precision Chip Resistors  
Page 1 of 2  
Style FC - Flip Chip version for surface mount applications.  
Style WB - Wire Bond version for hybrid applications with metallized back  
surface for solder down heat sinking of the chip, includes bondable termination  
pads to receive aluminum wire bonds.  
• Thermal resistance is provided to optimize high power designs when utilizing  
higher thermal conductivity circuit board substrates such as IMS or Alumina.  
• Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%,  
and 0.10 ohm at ±1%.  
• Low inductance provides excellent high frequency and pulse response.  
• High pulse handling and overload capability.  
• Best choice for switching power supplies, motor speed controls, and high  
current sensing applications.  
Style FC - Flip Chip Version is a surface mount version with solderable pads for flip chip soldering.  
Power Capability Information  
Resistance  
Dimensions in inches and (millimeters)  
General Applications High Power Applications  
Comments  
Thermal Resistance -  
Film (J) to Solder Pad (C)  
R
Max. Chip  
Temperature  
Power Rating  
θJC  
Model  
at 70° C  
Min.  
Max.  
A
B
C
D
(see note 1)  
(see note 2)  
.150 ±.007  
(3.81 ±.18)  
.120 ±.007  
(3.05 ±.18)  
.027 ±.005  
(.69 ±.13)  
.035 min.  
(0.89 min.)  
.035 min.  
(0.89 min.)  
.050 min.  
(1.27 min.)  
.065 min.  
(1.66 min.)  
Solder Coated Pads  
0.010  
0.020 Ω  
0.020 Ω  
0.010 Ω  
0.025 Ω  
0.015  
10.0 Ω  
10.0 Ω  
0.020 Ω  
10.0 Ω  
0.75 Watt  
0.75 Watt  
1.0 Watt  
22.7°C/Watt  
22.7°C/Watt  
16.0°C/Watt  
13.0°C/Watt  
11.5°C/Watt  
150°C  
150°C  
150°C  
150°C  
150°C  
CC1512FC  
.150 ±.007  
.120 ±.007  
.022 ±.003  
Solderable Pads  
Solderable Pads  
(3.81 ±.18)  
(3.05 ±.18)  
(.56 ±.08)  
.200 ±.007  
(5.08 ±.18)  
.150 ±.007  
(3.81 ±.18)  
.027 ±.003  
(.69 ±.08)  
CC2015FC  
CC2520FC  
.250 ±.007  
.200 ±.007  
.032 ±.005  
Solder Coated Pads  
1.5 Watts  
1.5 Watts  
(6.35 ±.18)  
(5.08 ±.18)  
(.81 ±.13)  
.250 ±.007  
(6.35 ±.18)  
.200 ±.007  
(5.08 ±.18)  
.041 ±.004  
(1.04 ±.10)  
.040 min.  
(1.02 min.)  
Solderable Pads  
CC1512FC Standard Resistance Values:  
Tolerance CC1512FC ±1% Standard (except as noted).  
Style FC Derating Curve For General Applications  
3.30 Ω  
4.00 Ω  
5.00 Ω  
7.50 Ω  
8.00 Ω  
10.0 Ω  
0.010 Ω 5%  
0.015 Ω 5%  
0.020 Ω 5%  
0.025 Ω 5%  
0.030 Ω 5%  
0.033 Ω 5%  
0.040 Ω 5%  
0.050 Ω 2%  
0.075 Ω 2%  
0.10 Ω  
0.20 Ω  
0.25 Ω  
0.30 Ω  
0.33 Ω  
0.40 Ω  
0.50 Ω  
0.75 Ω  
1.00 Ω  
1.50 Ω  
2.00 Ω  
2.50 Ω  
3.00 Ω  
100  
80  
Note 1: General Applications - The power rating  
for general applications is based upon 0.5 sq. in.  
(300 mm2) of termination pad or trace area (2 oz.  
copper) connected to each end of the resistor.  
Maximum chip temperature is 150°C. Use Derating  
Curve to derate appropriately for the maximum  
ambient temperature and for the temperature  
limitations of the adjacent materials.  
60  
0.15 Ω  
40  
CC2015FC Standard Resistance Values:  
Tolerance CC2015FC ±1% Standard (except as noted).  
20  
0
0.020 Ω 5%  
0.025 Ω 5%  
0.030 Ω 5%  
0.033 Ω 5%  
0.040 Ω 5%  
0.050 Ω 2%  
0.075 Ω 2%  
0.10 Ω  
0.20 Ω  
0.25 Ω  
0.30 Ω  
0.33 Ω  
0.40 Ω  
0.50 Ω  
0.75 Ω  
1.00 Ω  
1.50 Ω  
2.00 Ω  
2.50 Ω  
3.00 Ω  
3.30 Ω  
4.00 Ω  
5.00 Ω  
7.50 Ω  
8.00 Ω  
10.0 Ω  
25  
70  
100  
150  
AMBIENT TEMPERATURE, oC  
Note 2: Thermal Resistance - In High Power Applications where the circuit board  
material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal  
resistance of the chip resistor is useful to establish the maximum power capability of the  
chip resistor in the application. The film temperature is measured at the center of the  
resistor element and the solder pad temperature is measured at the center of the  
termination pad (point X in the recommended circuit layouts shown below). Maximum  
temperature of the chip resistor (at the center of chip) should not exceed 150°C through  
the temperature range of the application.  
0.15 Ω  
CC2520FC Standard Resistance Values:  
Tolerance CC2520FC ±1% Standard (except as noted).  
3.30 Ω  
4.00 Ω  
5.00 Ω  
7.50 Ω  
8.00 Ω  
10.0 Ω  
0.010 Ω 5%  
0.015 Ω 5%  
0.020 Ω 5%  
0.025 Ω 5%  
0.030 Ω 5%  
0.033 Ω 5%  
0.040 Ω 5%  
0.050 Ω 2%  
0.075 Ω 2%  
0.10 Ω  
0.75 Ω  
1.00 Ω  
1.50 Ω  
2.00 Ω  
2.50 Ω  
3.00 Ω  
0.20 Ω  
0.25 Ω  
0.30 Ω  
0.33 Ω  
0.40 Ω  
0.50 Ω  
0.15 Ω  
Recommended Circuit Board Layout  
(current and sense connections):  
Custom resistance values and non-standard tolerances  
can be manufactured for high quantity applications.  
Please contact Caddock Applications Engineering.  
Fig. 1A: Kelvin layout recom-  
mended for values below 0.20Ω  
C
C
Fig. 1B: Kelvin layout  
recommended for higher  
resistance values.  
C
C
X
X
C = Current connection  
S = Sense connection  
X
X
S
S
S
S
Note: Actual width of current trace is based on magnitude of current. Point of connection should be in the area shown.  
Applications Engineering  
Sales and Corporate Office  
17271 North Umpqua Hwy.  
1717 Chicago Avenue  
Riverside, California 92507-2364  
Phone: (951) 788-1700  
CADDOCK  
Roseburg, Oregon 97470-9422  
Phone: (541) 496-0700  
Fax: (541) 496-0408  
e-mail: caddock@caddock.com • web: www.caddock.com  
For Caddock Distributors listed by country see caddock.com/contact/dist.html  
Fax: (951) 369-1151  
© 2004 Caddock Electronics, Inc.  
28_IL106.1004  

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