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Creation Date : February 24, 2017
(GMT)
Multilayer Ceramic Chip Capacitors
C2012JB2E152M085AA
TDK item description C2012JB2E152MT****
Applications
Commercial Grade
Feature
Series
Status
Mid Mid Voltage (100 to 630V)
C2012 [EIA 0805]
Production (Not Recommended for New Design)
Size
Length(L)
2.00mm ±0.20mm
Width(W)
1.25mm ±0.20mm
0.85mm ±0.15mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
Capacitance
1.5nF ±20%
250VDC
JB(±10%)
3%
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
10000MΩ
Other
Wave (Flow)
Reflow
Soldering Method
AEC-Q200
No
Packing
Punched (Paper)Taping [180mm Reel]
4000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.