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C1812C152JDGAC7025

更新时间： 2023-05-15 00:00:00
品牌 Logo 应用领域
基美 - KEMET /
页数 文件大小 规格书
10页 2297K
描述
Ceramic Capacitor, Ceramic, 1000V, 5% +Tol, 5% -Tol, C0G, -/+30ppm/Cel TC, 0.0015uF, 1812,

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C1812C152JDGAC7025 数据手册

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CERAMIC CHIP / HIGH VOLTAGE  
CAPACITOR ORDERING INFORMATION  
C
0805  
C
102  
K
C
R
A
C
Style  
C - Ceramic  
Chip Size  
0805; 1206; 1210; 1808;  
1812; 1825; 2220; 2225  
End Metallization  
C = Standard  
L = SnPb plated nickel barrier  
(SnPb 5% min)  
Specification  
C - Standard  
Capacitance Code, pF  
First two digits represent significant figures.  
Third digit specifies number of zeros. 100 pF = 101.  
(Use “9” for 1.0 through 9.9 pF)  
Failure Rate Level  
A = Not Applicable  
Temperature Characteristic  
Designated by Capacitance  
Change over Temperature Range  
(Use “8” for 0.1 through .99 pF)  
G – (C0G) (±30ppm/C) (-55°C +125°C)  
R – X7R (±15%) (-55°C +125°C)  
Capacitance Tolerance  
C = ±0.25pF*  
D = ±0.5pF*  
F = ±1%*  
G = ±2%*  
* Contact KEMET Sales for availability.  
J = ±5%  
K = ±10%  
M = ±20%  
Voltage  
C = 500V  
B = 630V  
D = 1000V  
F = 1500V  
G = 2000V  
Z = 2500V  
H = 3000V  
ELECTRICAL PARAMETERS  
Property  
Specification  
C0G: 1 pF to 0.010 µF  
X7R: 10pFto 0.22 µF  
Capacitance  
25°C, 1.0 0.2 Vrms, 1 kHz (1 MHz for ≤ 1000 pF (C0G only)  
C0G: C*, D*, F*, G*, J, K, M  
X7R: J, K, M  
C0G: 0.1% Max  
* Contact KEMET Sales for availability.  
Cap Tolerance  
DF  
X7R: 2.5% Max  
Voltage Ratings  
500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V  
Operating Temperature Range  
25ºC IR @ 500V  
From -55ºC to +125ºC  
100 GΩ or 1000 MΩ-µF, whichever is less  
10 GΩ or 100 MΩ-µF, whichever is less  
125ºC IR @ 500V  
-55ºC TCC  
X7R: + 15%  
+125ºC TCC  
C0G: + 30 ppm / ºC  
150% of Rated Voltage for Rated Voltage <1000 V  
120% of Rated Voltage for Rated Voltage >=1000V  
Dielectric Strength  
Ripple Current  
Consult KEMET Sales Representative  
MARKING  
These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost.  
Details on the marking format is located on page 97.  
PACKAGING  
KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk  
bag as outlined on page 83. Please consult factory for waffle packaging options.  
SOLDERING PROCESS  
The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and  
larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of  
pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of  
the termination.  
RECOMMENDED SOLDER PAD DIMENSIONS  
T (Total Length)  
S (Separation  
W (Pad Width)  
L (Pad Length)  
Chip Size  
mm  
3.30  
4.50  
4.50  
5.90  
5.90  
5.90  
7.00  
7.00  
in.  
mm  
0.70  
1.50  
1.50  
2.30  
2.30  
2.30  
3.30  
3.30  
in.  
mm  
in.  
mm  
1.30  
1.50  
1.50  
1.80  
1.80  
1.80  
1.85  
1.85  
in.  
0805  
1206  
1210  
1808  
1812  
1825  
2220  
2225  
0.130  
0.177  
0.177  
0.232  
0.232  
0.232  
0.276  
0.276  
0.028  
0.059  
0.059  
0.091  
0.091  
0.091  
0.130  
0.130  
1.60  
2.00  
2.90  
2.40  
3.70  
6.90  
5.50  
6.80  
0.063  
0.079  
0.114  
0.094  
0.146  
0.272  
0.217  
0.268  
0.051  
0.059  
0.059  
0.071  
0.071  
0.071  
0.073  
0.073  
84  
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300  
1234567...10

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