Datasheet > C-129-155-TDFB3-SSC6EG5

C-129-155-TDFB3-SSC6EG5

更新时间： 2022-12-01 19:31:31

品牌	Logo	应用领域
SOURCE		/
页数	文件大小	规格书
9页	249K
描述
Transceiver, 1285nm Min, 1298nm Max, 155Mbps(Tx), 155Mbps(Rx), SC Connector, Through Hole Mount

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C-129-155-TDFB3-SSC6EG5 数据手册

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P/N: C-1xx-155-TDFB(3)-SSC6x(-G5)

155 Mbps CWDM Laser Single Mode Transceiv

Recommended Circuit Schematic

C-1xx-155-TDFB(3)-SSC6(D/E)

Tx Vcc

Rx Vcc

6 5 4 3

R1 R3

R5 R7

RD +

RD -

TD +

TD -

Tx Vcc

Rx Vcc

R2 R4

R10 R6 R8

No internal

connection

No internal

connection

Transceiver

Top view

Rx Vcc

Tx Vcc

Notes +3.3V:

Notes +5V:

Vcc

R1=R3=R5=R7=R9=130Ω R1=R3=R5=R7=R9=82Ω

R2=R4=R6=R8=R10=82Ω R2=R4=R6=R8=R10=130Ω

C1=C2=C3=C5=C6=0.1μF C1=C2=C3=C5=C6=0.1μF

C4=10μF

L1=L2=1μH

The split-loaded terminations for ECL signals need to be located at the input of devices receiving those ECL signals.

The power supply filtering is required for good EMI performance. Use short tracks from the inductor L1/L2 to the module

Rx Vcc. / Tx Vcc.

A GND plane under the module is required for good EMI and sensitivity performance.

- 5 -

DS-6118 Rev 0.0 2010-05-10

1 2 3 456 7 8 9

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