Datasheet > BYD67A

BYD67A

更新时间： 2024-10-01 06:44:51

品牌	Logo	应用领域
EIC		二极管
页数	文件大小	规格书
2页	104K
描述
RIPPLE BOCKING DIODE

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中文翻译

获取价格

技术参数
数据手册

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BYD67A 技术参数

是否无铅：	不含铅	生命周期：	Active
Reach Compliance Code：	compliant	ECCN代码：	EAR99
风险等级：	5.76	Base Number Matches：	1

BYD67A 数据手册

TH97/10561QM

TW00/17276EM

IATF 0060636

SGS TH07/1033

RIPPLE BOCKING DIODE

BYD67A

SMA (DO-214AC)

PRV : 300 Volts

Io : 1.2 Amperes

1.1 ± 0.3

FEATURES :

0.2 ± 0.07

* Glass passivated junction chip

* High maximum operating temperature

* Low leakage current

1.2 ± 0.2

2.1 ± 0.2

2.6 ± 0.15

* Excellent stability

* Smallest surface mount rectifier outline

* Pb / RoHS Free

2.0 ± 0.2

MECHANICAL DATA :

* Case : SMA Molded plastic

Dimensions in millimeters

* Epoxy : UL94V-O rate flame retardant

* Lead : Lead Formed for Surface Mount

* Polarity : Color band denotes cathode end

* Mounting position : Any

* Weight : 0.067 gram

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Rating at 25 °C ambient temperature unless otherwise specified

RATING

VALUE

300

SYMBOL

V_RRM

UNIT

Maximum Repetitive Peak Reverse Voltage

Maximum Continuous Reverse Voltage

Maximum Average Forward Current

V_R

300

1.2 ⁽¹⁾

0.4 ⁽²⁾

I_F(AV)

I_FSM

I_FRM

V_F

5.0

Maximum Non-Repetitive Peak Forward Surge Current (Note 3)

Maximum Repetitive Peak Forward Current at Ttp = 85 °C

Maximum Forward Voltage at I_F= 1.0 A, T_J= 25 °C

2.3

1.0

Maximum Reverse Current at V_R= V_RRMmax

T_J= 25 °C

I_R

μA

T_J= 165 °C

I_R(H)

Trr

100

μA

150

Maximum Reverse Recovery Time (Note 4)

Thermal Resistance from Junction to Tie-Point

Rth j-tp

Rth j-a

T_J

K / W

°C

150

Thermal Resistance from Junction to Ambient (Note 5)

Junction Temperature Range

- 65 to + 175

T_STG

Storage Temperature Range

°C

Notes :

(1) Ttp = 85 °C; see Fig. 1; averaged over any 20 ms period; see Fig. 2

(2) Tamb = 60 °C; PCB mounting ; see Fig. 3; averaged over any 20 ms period; see also Fig.2

(3) t=10ms half sine wave; Tj = Tjmax prior to surge; V_R= V_RRMmax

(4) Reverse Recovery Test Conditions : I_F= 0.5 A, I_R= 1.0 A, Irr = 0.25 A.

(5) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥ 40 μm.

Page 1 of 2

Rev. 00 : February 13, 2008

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