BYD37GA

更新时间： 2024-09-30 06:44:51

品牌	Logo	应用领域
EIC		整流二极管局域网
页数	文件大小	规格书
2页	106K
描述
AVALANCHE FAST SOFT-RECOVERY RECTIFIER DIODES

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中文翻译

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数据手册

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BYD37GA 数据手册

TH97/10561QM

TW00/17276EM

IATF 0060636

SGS TH07/1033

AVALANCHE FAST SOFT-RECOVERY

RECTIFIER DIODES

BYD37DA - BYD37MA

SMA (DO-214AC)

PRV : 200 - 1000 Volts

Io : 1.5 Amperes

1.1 ± 0.3

FEATURES :

* Glass passivated junction chip.

* High maximum operating temperature

* Low leakage current

* Excellent stability

* Smallest surface mount rectifier outline

* Pb / RoHS Free

0.2 ± 0.07

1.2 ± 0.2

2.1 ± 0.2

2.6 ± 0.15

MECHANICAL DATA :

* Case : SMA Molded plastic

2.0 ± 0.2

* Epoxy : UL94V-O rate flame retardant

* Lead : Lead Formed for Surface Mount

* Polarity : Color band denotes cathode end

* Mounting position : Any

Dimensions in millimeters

* Weight : 0.067 gram

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

BYD BYD BYD BYD BYD

37DA 37GA 37JA 37KA 37MA

RATING

SYMBOL

UNIT

V_RRM

V_R

Maximum Repetitive Peak Reverse Voltage

200

300

400

500

600

700

1.5

800

900

1000

1100

Maximum Continuous Reverse Voltage

Min. Reverse Avalanche Breakdown Voltage @ I_R= 0.1 mA

Maximum Average Forward Current Ttp = 105 °C (Note 1)

Maximum Non-Repetitive Peak Forward Surge Current (Note 2)

Maximum Repetitive Peak Forward Current

V_(BR)R-min

I_F(AV)

I_FSM

I_FRM

V_F

Maximum Forward Voltage at 1.0 A

1.3

1.0

100

Maximum Reverse Current at V_R=V_RRMmax

T_J= 20 °C

I_R

μA

K / W

°C

T_J= 165 °C

I_R(H)

Maximum Reverse Recovery Time (Note 3)

Thermal Resistance from Junction to Tie-Point

Trr

250

300

Rth j-tp

Rth j-a

T_J

Thermal Resistance from Junction to Ambient (Note 4)

Junction Temperature Range

120

- 65 to + 175

T_STG

Storage Temperature Range

Notes :

(1) Averaged over any 20 ms period.

(2) t=10ms half sine wave; Tj = Tjmax prior to surge; V_R= V_RRMmax

(3) Reverse Recovery Test Conditions : IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A.

(4) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥ 40 μm.

Page 1 of 2

Rev. 02 : February 29, 2008

中文翻译

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