Datasheet > BVS-166UG2-12

BVS-166UG2-12

更新时间： 2022-10-18 14:22:31

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BVS-166UG2-12 数据手册

BRIGHT VIEW

ELECTRONICS CO.,LTD

SMD APPLICATION ( PB FREE SOLDERING )

Apply to BVS-3XXΕ1XX series.

Description:

(1) Manual soldering (We do not recommend this method strongly.)

(1.1) To prevent cracking,please bake (65к,24hrs)before soldering.

(1.2) Temperature at tip of iron: 250к Max.(25W)

(1.3) It's banned to load any stress on the resin during soldering.

(1.4) Soldering time: 3 sec. Max.(one time only)

(2) Reflow Soldering

(2.1) To prevent cracking,please bake (65к,24hrs)before soldering.

(2.2) When soldering,do not put stress on the LEDs during heating.

(2.3) Never take next process until the component is cooled down to room

temperature after reflow.

(2.4) After soldering,do not warp the circuit board.

(2.5) The recommended reflow soldering profile(measuring on the surface

of the LED resin)is following:

10 SEC. MAX.

245 C MAX.

0.5к/SEC MAX.

217к

150к

TEMPERATURE

1к/SEC. MAX.

~25к

50 SEC. MAX.

~75к

100 SEC. MAX.

210 SEC. MIN.

TIME

The reflow temperature 240к~245к is recommended and the soldering temperature

should be not higher than 245к(one time only)

2005 / 10 / 20 - B

123

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