BUF634A
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SBOS948E – FEBRUARY 2019 – REVISED DECEMBER 2020
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings ....................................... 4
7.2 ESD Ratings .............................................................. 4
7.3 Recommended Operating Conditions ........................4
7.4 Thermal Information ...................................................4
7.5 Electrical Characteristics: Wide-Bandwidth Mode ..... 5
7.6 Electrical Characteristics: Low-Quiescent
Current Mode ............................................................... 6
7.7 Typical Characteristics................................................7
8 Detailed Description......................................................13
8.1 Overview...................................................................13
8.2 Functional Block Diagram.........................................13
8.3 Feature Description...................................................14
8.4 Device Functional Modes..........................................15
9 Application and Implementation..................................16
9.1 Application Information............................................. 16
9.2 Typical Application.................................................... 18
10 Power Supply Recommendations..............................20
10.1 Power Dissipation and Thermal Considerations.....20
11 Layout...........................................................................21
11.1 Layout Guidelines................................................... 21
11.2 Layout Example...................................................... 23
12 Device and Documentation Support..........................24
12.1 Device Support....................................................... 24
12.2 Documentation Support.......................................... 24
12.3 Receiving Notification of Documentation Updates..24
12.4 Support Resources................................................. 24
12.5 Trademarks.............................................................25
12.6 Electrostatic Discharge Caution..............................25
12.7 Glossary..................................................................25
13 Mechanical, Packaging, and Orderable
Information.................................................................... 25
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (September 2020) to Revision E (December 2020)
Page
•
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Deleted preview statement for BUF634A VSON package..................................................................................1
Deleted preview statement for the DRB package...............................................................................................3
Changes from Revision C (June 2020) to Revision D (September 2020)
Page
Updated the numbering format for tables, figures, and cross-references throughout the document..................1
Added DRB package outline to Mechanical, Packaging, and Orderable Information section.......................... 25
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•
Changes from Revision B (January 2020) to Revision C (June 2020)
Page
Deleted preview statement for BUF634A HSOIC package................................................................................ 1
Deleted preview statement for the D and DDA packages.................................................................................. 3
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•
Changes from Revision A (May 2019) to Revision B (January 2020)
Page
•
•
•
•
•
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Added DRB (VSON) and DDA (HSOIC) packages to document........................................................................1
Changed Applications section............................................................................................................................ 1
Changed last paragraph of Description section .................................................................................................1
Added discussion of VIN pin to ESD Protection section....................................................................................14
Added Power Dissipation and Thermal Considerations section.......................................................................20
Added HSOIC Layout Guidelines (DDA Package With a Thermal Pad) section..............................................22
Changed title of BUF634A Layout Example image.......................................................................................... 23
Changes from Revision * (February 2019) to Revision A (May 2019)
Page
•
Changed document status from Advance Information to Production Data ........................................................1
Copyright © 2020 Texas Instruments Incorporated
2
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