BTS436L2
Parameter and Conditions
Symbol
Values
Unit
at Tj =-40...+150°C, V = 12 V unless otherwise specified
bb
min
typ
max
Protection Functions10)
Current limit (pin 3 to 5)
IL(lim)
(see timing diagrams on page 11)
Tj =-40°C:
Tj =25°C:
46
39
30
58
51
38
68
58
46
A
Tj =+150°C:
Repetitive short circuit shutdown current limit
IL(SCr)
Tj = Tjt (see timing diagrams, page 11)
--
--
40
1.9
--
--
A
ms
Thermal shutdown time11)
Tj,start = 25°C: toff(SC)
(see timing diagrams on page 11)
Output clamp (inductive load switch off)
41
43
at VOUT = Vbb - VON(CL)
IL= 40 mA: VON(CL)
47
--
10
--
52
--
V
°C
K
Thermal overload trip temperature
Thermal hysteresis
Tjt
150
--
∆Tjt
--
Reverse battery (pin 3 to 1) 12)
-Vbb
--
32
V
13 )
Reverse battery voltage drop (V > V
)
out
bb
IL = -2 A
T=150 °C: -VON(rev)
j
--
600
-- mV
Diagnostic Characteristics
Open load detection current
IL (OL)
100
--
900
mA
(on-condition)
Input and Status Feedback14
)
Input resistance
RI
2.5
3.5
6
kΩ
see circuit page 7
Input turn-on threshold voltage
Input turn-off threshold voltage
Input threshold hysteresis
Off state input current (pin 2), VIN = 0.4 V
On state input current (pin 2), VIN = 5 V
VIN(T+)
VIN(T-)
1.7
1.5
--
--
--
0.5
--
50
520
3.2
--
V
V
V
∆ VIN(T)
--
IIN(off)
IIN(on)
td(ST OL4)
1
50 µA
90 µA
900 µs
20
100
Delay time for status with open load after switch off
(see timing diagrams on page 11)
Status output (open drain)
Zener limit voltage
ST low voltage
IST = +1.6 mA: VST(high)
IST = +1.6 mA: VST(low)
5.4
--
6.1
--
--
V
0.4
10
)
Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are
not designed for continuous repetitive operation.
11
12
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for V
)
bb
connection. PCB is vertical without blown air.
)
Requires 150 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source
diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal
operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature
protection is not active during reverse current operation! Input and Status currents have to be limited (see
max. ratings page 3 and circuit page 7).
13
14
)
)
not subject to production test, specified by design
If a ground resistor R
is used, add the voltage drop across this resistor.
GND
Semiconductor Group
Page 5
2003-Oct-01