WeEn Semiconductors
BTA316X-800C
3Q Hi-Com Triac
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-h)
thermal resistance
from junction to
heatsink
full cycle or half cycle; with heatsink
compound; Fig 6
-
-
4
K/W
full cycle or half cycle; without heatsink
compound; Fig 6
-
-
-
5.5
K/W
K/W
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
55
-
t
p
P
δ =
T
t
t
p
T
(1) Unidirectional (half cycle) without heatsink compound
(2) Unidirectional (half cycle) with heatsink compound
(3) Bidirectional (full cycle) without heatsink compound
(4) Bidirectional (full cycle) with heatsink compound
Fig. 6. Transient thermal impedance from junction to heatsink as a function of pulse duration
10. Isolation characteristics
Table 7. Isolation characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Visol(RMS)
RMS isolation voltage
from all terminals to external heatsink;
sinusoidal waveform; clean and dust
free; 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %;
Th = 25 °C
-
-
2500
V
Cisol
isolation capacitance
from main terminal 2 to external
-
10
-
pF
heatsink; f = 1 MHz; Th = 25 °C
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BTA316X-800C
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WeEn Semiconductors Co., Ltd. 2023. All rights reserved
Product data sheet
29 January 2023
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