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BSP752R PDF预览

BSP752R

更新时间: 2024-02-11 07:18:38
品牌 Logo 应用领域
英飞凌 - INFINEON 外围驱动器驱动程序和接口开关接口集成电路光电二极管
页数 文件大小 规格书
17页 378K
描述
Smart Power High-Side-Switch

BSP752R 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:SOP,针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.03
内置保护:TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE接口集成电路类型:BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 代码:R-PDSO-G8长度:5 mm
功能数量:1端子数量:8
输出电流流向:SINK标称输出峰值电流:1.7 A
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:1.75 mm最大供电电压:52 V
最小供电电压:6 V标称供电电压:13.5 V
表面贴装:YES技术:MOS
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
断开时间:200 µs接通时间:180 µs
宽度:4 mmBase Number Matches:1

BSP752R 数据手册

 浏览型号BSP752R的Datasheet PDF文件第1页浏览型号BSP752R的Datasheet PDF文件第2页浏览型号BSP752R的Datasheet PDF文件第4页浏览型号BSP752R的Datasheet PDF文件第5页浏览型号BSP752R的Datasheet PDF文件第6页浏览型号BSP752R的Datasheet PDF文件第7页 
BSP 752 R  
Maximum Ratings at Tj = 25°C, unless otherwise specified  
Parameter  
Supply voltage  
Supply voltage for full short circuit protection  
Continuous input voltage  
Load current (Short - circuit current, see page 5) I  
Symbol  
Value  
52  
50  
Unit  
V
V
V
V
bb  
bb(SC)  
IN  
-10 ... +16  
self limited  
A
L
mA  
°C  
Current through input pin (DC)  
Operating temperature  
Storage temperature  
I
± 5  
-40 ...+150  
-55 ... +150  
1.5  
IN  
T
T
P
E
j
stg  
tot  
AS  
1)  
W
mJ  
Power dissipation  
1)2)  
125  
Inductive load switch-off energy dissipation  
single pulse, (see page 9 )  
Tj =150 °C, I = 1 A  
L
2)  
3)  
V
Load dump protection V  
= V + V  
V
LoadDump  
A
S
Loaddump  
R =2, t =400ms, V = low or high, V =13,5V  
I
d
IN  
A
R = 13.5 Ω  
73.5  
83.5  
L
R = 27 Ω  
L
kV  
Electrostatic discharge voltage (Human Body Model) V  
according to ANSI EOS/ESD - S5.1 - 1993  
ESD STM5.1 - 1998  
ESD  
Input pin  
all other pins  
± 1  
± 5  
Thermal Characteristics  
-
-
95  
70  
-
83  
K/W  
Thermal resistance @ min. footprint  
R
th(JA)  
R
th(JA)  
2
1)  
Thermal resistance @ 6 cm cooling area  
1
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain  
connection. PCB is vertical without blown air. (see page 17)  
2
not subject to production test, specified by design  
3
V
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 .  
Loaddump  
Supply voltages higher than V  
require an external current limit for the GND pin, e.g. with a  
bb(AZ)  
150resistor in GND connection. A resistor for the protection of the input is integrated.  
2004-01-27  
Page 3  

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