Datasheet > BR24G16FVT-5

BR24G16FVT-5

更新时间： 2024-04-09 18:58:21

品牌	Logo	应用领域
罗姆 - ROHM		可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数	文件大小	规格书
38页	2303K
描述
BR24G16FVT-5 is a 16Kbit serial EEPROM of I²C BUS Interface.

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BR24G16FVT-5 数据手册

BR24G16xxx-5 Series

Thermal Resistance^{(Note 7)}- continued

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 9)}

2s2p^{(Note 10)}

VSON008X2030

308.3

69.6

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 8)}

θ_JA

°C/W

Ψ_JT

(Note 7) Based on JESD51-2A (Still-Air).

(Note 8) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

(Note 9) Using a PCB board based on JESD51-3.

(Note 10) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Layer Number of

Measurement Board

Thermal Via^{(Note 11)}

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Pitch

Diameter

4 Layers

1.20 mm

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

70 μm

Copper Pattern

Thickness

Copper Pattern

Thickness

70 μm

Footprints and Traces

74.2 mm x 74.2 mm

35 μm

74.2 mm x 74.2 mm

(Note 11) This thermal via connect with the copper pattern of layers 1,2, and 4. The placement and dimensions obey a land pattern.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0G2G0G101060-1-2

19.Oct.2023 Rev.001

5/35

1 2 3 456 7 8...38

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