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BPW676-1630-26AB95 PDF预览

BPW676-1630-26AB95

更新时间: 2024-02-05 04:34:17
品牌 Logo 应用领域
ACTEL /
页数 文件大小 规格书
8页 1368K
描述
IC Socket, BGA676, 676 Contact(s), ROHS COMPLIANT

BPW676-1630-26AB95 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:ROHS COMPLIANTReach Compliance Code:compliant
风险等级:5.83联系完成配合:GOLD/TIN
联系完成终止:GOLD/TIN触点材料:BERYLLIUM COPPER
设备插槽类型:IC SOCKET使用的设备类型:BGA676
外壳材料:PLASTICJESD-609代码:e4/e3
触点数:676Base Number Matches:1

BPW676-1630-26AB95 数据手册

 浏览型号BPW676-1630-26AB95的Datasheet PDF文件第2页浏览型号BPW676-1630-26AB95的Datasheet PDF文件第3页浏览型号BPW676-1630-26AB95的Datasheet PDF文件第4页浏览型号BPW676-1630-26AB95的Datasheet PDF文件第5页浏览型号BPW676-1630-26AB95的Datasheet PDF文件第7页浏览型号BPW676-1630-26AB95的Datasheet PDF文件第8页 
Socket Mounting Recommendations and Reflow Profile  
Verifying the Assembly  
After the socket has been reflowed to the PCB, open and short testing should be partaken to  
ensure proper assembly. The assembly house typically performs x-ray inspection to verify non-  
shorting of pins. However, as this is only a visual inspection, we recommend using a continuity  
tester or ohmmeter and simply sweeping random rows and columns of pins to ensure no shorting  
of pins. No damage to the springs will occur if very slight pressure from the meter’s tips is  
applied (just touch the probes to the springs). For fine pitch sockets, a microscope would be  
helpful in placing the meter’s tips appropriately.  
After verifying the absence of shorts, open testing should be performed. The most direct, yet  
tedious, method is to use the continuity tester to directly probe each pin to a breakout or test  
point on the board. Again no damage will occur if the probes are touched to the springs. If heavy  
pressure is required to push the socket body towards the PCB to achieve continuity, this means a  
poor solder joint. If no such test points exist, then the BGA’s via field on the backside of the  
PCB should be kept solder-mask free to allow for such probing. If the via field is kept open, a  
simpler open testing method can be performed. Simply use a wet sponge (or some other  
conductive material) and hold it onto the via field. This shorts all the pins together on the PCB.  
Insert one probe of the continuity tester into the sponge. Now sweep the pins of the socket with  
the other probe and check for continuity.  
If the above procedures show any shorts or opens, then it is advisable to have the assembly house  
re-evaluate the assembly method used. An incorrect stencil can lead to too much or too little  
solder paste, easily leading short or open conditions and a solder paste with Ag contents  
(>=0.5%) may also result in solder joint failures. These are the primary reasons for socket  
mounting failures.  
Important Notes:  
a) Screw/Twist Lock Socket  
When tightening the lid of a Screw or Twist Lock socket, it is imperative to not over-tighten the  
retention screws, otherwise irreparable damage may occur. Such damage is not covered by  
warranty and will be solely the end user’s responsibility. The maximum allowed torque on these  
retention screws is 7cN-m (10oz-in) for sockets up to 800 pins and for sockets as of 800 pins the  
torque value needs to be increased but should not exceed a maximum of 10cN-m (14oz-in). E-tec  
sells the torque screwdriver TOL-7CN-TORQUE which is preset to 7cN-m, but which can be  
adjusted to higher torque values for the high pin count sockets.  
E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland  
Phone +41-21-781 08 10 · www.e-tec.com · info@e-tec.com  
4
E-tec Socket Mounting Recommendations  
PRELIMINARY  

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