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BCM4325FKFBG PDF预览

BCM4325FKFBG

更新时间: 2024-02-28 13:47:56
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 电信电信集成电路
页数 文件大小 规格书
139页 2480K
描述
Telecom Circuit, 1-Func, PBGA196, FBGA-196

BCM4325FKFBG 技术参数

生命周期:Active包装说明:TFBGA,
Reach Compliance Code:compliant风险等级:5.62
JESD-30 代码:S-PBGA-B196长度:7.5 mm
功能数量:1端子数量:196
最高工作温度:85 °C最低工作温度:-30 °C
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装形状:SQUARE封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
座面最大高度:1.05 mm标称供电电压:1.25 V
表面贴装:YES电信集成电路类型:TELECOM CIRCUIT
温度等级:OTHER端子形式:BALL
端子节距:0.5 mm端子位置:BOTTOM
宽度:7.5 mmBase Number Matches:1

BCM4325FKFBG 数据手册

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Preliminary Data Sheet  
6/30/09  
BCM4325  
Revision  
Date  
Description  
4325-DS02-R  
08/15/08  
Updated:  
Figure 8, ”Power Supply Building Blocks,on page 27.  
Table 3, ”Crystal Interface Signal Characteristics,” on page 31.  
Voltage for integrated LDO pins in Table 7 on page 44 and Table 8 on page 53.  
Table 19, ”Absolute Maximum Ratings,on page 75.  
Table 20, ”Recommended Operating Conditions and DC Characteristics,on page 75.  
Table 28, ”2.4-GHz Band Transmitter RF Specifications,” on page 85.  
Table 30, ”2.4-GHz Receiver Performance Specifications,on page 86.  
Table 49, ”196-Ball FBGA Package Thermal Characteristics,” on page 110.  
Figure 28, ”339-Pin WLCSP Mechanical Information,on page 113.  
Table 52, ”Ordering Information,on page 118.Added:  
Figure 9, ”Power Topology Example,” on page 28.  
Table 15, ”Pin Default Pull-Up/Pull-Down,” on page 69.  
Table 16, ”BT/FM Interface I/O Status,” on page 71.  
Table 17, ”WLAN Interface I/O Status,” on page 72.  
Table 21, ”Bluetooth and FM Current,” on page 76.  
“SDIO Timing” on page 102.  
Section 21 ”Power-Up Sequence and Timing” on page 105.  
Figure 24, ”Power-Up Timing for WL Off and BT Off (VDDC Provided Externally),” on  
page 108.  
Table 51, ”Miscellaneous Characteristics,” on page 111.  
Figure 30, ”WLAN Section Second Metal Keepout Area,” on page 115.  
4325-DS01-R  
12/14/07  
Updated:  
General Description on page i  
Features on page ii  
Figure 2, ”BCM4325 Block Diagram,” on page 1  
Section 2 ”Bluetooth + FM Subsystem Overview” on page 2  
Integrated Section 3 into Section 2 ”Bluetooth + FM Subsystem Overview” on page 2  
Section 4 ”Microprocessor and Memory Unit for Bluetooth”: “External Reset” on page 11  
Section 6 ”FM Receiver Subsystem”:  
- RDS/RBDS” on page 18  
- Other Features” on page 18  
Section 8 ”WLAN 802.11 Radio Subsystem”: “Transmitter Path” on page 25  
Section 12 ”BCM4325 On-Chip Power Supplies”:  
- Figure 8, ”BCM4325 Power Supply Building Blocks,” on page 28  
- BCM4325 Example Power Supply Topology” on page 29  
- Removed “BCM4325 Power Supply Applications–Power Efficiency  
Section 13 ”Frequency References”:  
- Table 3, ”Crystal Interface Signal Characteristics,” on page 32  
- Figure 11, ”Recommended Oscillator Configuration,” on page 33  
- Figure 12, ”Recommended TCXO Connection,” on page 33  
Broadcom Corporation  
Document 4325-DS04-R  
Page v  

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