是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | VFBGA, BGA133,12X12,16 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.11 |
Is Samacsys: | N | JESD-30 代码: | R-PBGA-B133 |
长度: | 5.33 mm | 功能数量: | 1 |
端子数量: | 133 | 最高工作温度: | 85 °C |
最低工作温度: | -30 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装等效代码: | BGA133,12X12,16 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
电源: | 3.6 V | 认证状态: | Not Qualified |
座面最大高度: | 0.55 mm | 子类别: | Other Telecom ICs |
标称供电电压: | 1.2 V | 表面贴装: | YES |
电信集成电路类型: | TELECOM CIRCUIT | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 0.4 mm |
端子位置: | BOTTOM | 宽度: | 4.89 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
BCM4330HB2KUBG | BOARDCOM |
获取价格 |
Single Chip IEEE 802.11⢠a/b/g/n MAC/Baseba | |
BCM4330SB2KUBG | BOARDCOM |
获取价格 |
Single Chip IEEE 802.11⢠a/b/g/n MAC/Baseba | |
BCM4330XB2KFFBG | BOARDCOM |
获取价格 |
Single Chip IEEE 802.11⢠a/b/g/n MAC/Baseba | |
BCM4330XKFFBG | CYPRESS |
获取价格 |
Telecom Circuit, 1-Func, PBGA144, FCFBGA-144 | |
BCM4330XKUBG | CYPRESS |
获取价格 |
Telecom Circuit, 1-Func, PBGA133, WLBGA-133 | |
BCM4330XKUBG | BOARDCOM |
获取价格 |
Single Chip IEEE 802.11⢠a/b/g/n MAC/Baseba | |
BCM4330XKWBG | BOARDCOM |
获取价格 |
Single Chip IEEE 802.11⢠a/b/g/n MAC/Baseba | |
BCM43340 | CYPRESS |
获取价格 |
Single-Chip, Dual-Band (2.4 GHz/5 GHz) IEEE 802.11 a/b/g/n MAC/Baseband/Radio with Integra | |
BCM43340HKUBG | CYPRESS |
获取价格 |
Single-Chip, Dual-Band (2.4 GHz/5 GHz) IEEE 802.11 a/b/g/n MAC/Baseband/Radio with Integra | |
BCM43340HKUBGT | CYPRESS |
获取价格 |
Single-Chip, Dual-Band (2.4 GHz/5 GHz) IEEE 802.11 a/b/g/n MAC/Baseband/Radio with Integra |