Philips Semiconductors
Product specification
High-speed double diode
BAV70
FEATURES
DESCRIPTION
PINNING
PIN
• Small plastic SMD package
The BAV70 consists of two
high-speed switching diodes with
common cathodes, fabricated in
planar technology, and encapsulated
in the small SOT23 plastic SMD
package.
DESCRIPTION
• High switching speed: max. 4 ns
1
2
3
anode (a1)
• Continuous reverse voltage:
max. 70 V
anode (a2)
common cathode
• Repetitive peak reverse voltage:
max. 75 V
• Repetitive peak forward current:
max. 450 mA.
3
handbook, halfpage
3
APPLICATIONS
1
2
• High-speed switching in thick and
thin-film circuits.
1
2
Top view
MAM383
Marking code: A4p = made in Hong Kong. A4t = made in Malaysia.
Fig.1 Simplified outline (SOT23) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
Per diode
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VRRM
VR
repetitive peak reverse voltage
continuous reverse voltage
continuous forward current
−
−
−
85
V
V
75
IF
single diode loaded; note 1;
see Fig.2
215
mA
mA
mA
double diode loaded; note 1;
see Fig.2
−
−
125
450
IFRM
IFSM
repetitive peak forward current
non-repetitive peak forward current square wave; Tj = 25 °C prior to
surge; see Fig.4
t = 1 µs
t = 1 ms
t = 1 s
−
−
−
−
4
A
1
A
0.5
250
+150
150
A
Ptot
Tstg
Tj
total power dissipation
storage temperature
junction temperature
Tamb = 25 °C; note 1
mW
°C
°C
−65
−
Note
1. Device mounted on an FR4 printed-circuit board.
1999 May 05
2