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BAV70,235 PDF预览

BAV70,235

更新时间: 2024-02-10 21:32:23
品牌 Logo 应用领域
恩智浦 - NXP 光电二极管
页数 文件大小 规格书
15页 96K
描述
BAV70 series - High-speed switching diodes TO-236 3-Pin

BAV70,235 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:TO-236包装说明:PLASTIC, SMD, 3 PIN
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.70
风险等级:6.78配置:COMMON CATHODE, 2 ELEMENTS
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
最大正向电压 (VF):1.25 VJEDEC-95代码:TO-236AB
JESD-30 代码:R-PDSO-G3JESD-609代码:e3
湿度敏感等级:1最大非重复峰值正向电流:4 A
元件数量:2端子数量:3
最高工作温度:150 °C最大输出电流:0.125 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
最大功率耗散:0.25 W认证状态:Not Qualified
最大重复峰值反向电压:100 V最大反向电流:2.5 µA
最大反向恢复时间:0.004 µs子类别:Rectifier Diodes
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:40Base Number Matches:1

BAV70,235 数据手册

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BAV70 series  
NXP Semiconductors  
High-speed switching diodes  
Table 6.  
Limiting values …continued  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Parameter  
total power dissipation  
BAV70  
Conditions  
Min  
Max  
Unit  
[2]  
[3]  
Ptot  
T
amb 25 °C  
amb 25 °C  
-
-
-
-
-
250  
250  
350  
170  
200  
mW  
mW  
mW  
mW  
mW  
BAV70M  
T
BAV70S  
Ts = 60 °C  
Ts = 90 °C  
BAV70T  
BAV70W  
T
amb 25 °C  
Per device  
IF  
forward current  
BAV70  
T
amb 25 °C  
-
125  
75  
mA  
mA  
mA  
mA  
mA  
°C  
BAV70M  
Ts = 90 °C  
Ts = 60 °C  
Ts = 90 °C  
-
BAV70S  
-
100  
75  
BAV70T  
-
BAV70W  
T
amb 25 °C  
-
100  
150  
+150  
+150  
Tj  
junction temperature  
ambient temperature  
storage temperature  
-
Tamb  
Tstg  
65  
65  
°C  
°C  
[1] Tj = 25 °C prior to surge.  
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard  
footprint.  
[3] Reflow soldering is the only recommended soldering method.  
6. Thermal characteristics  
Table 7.  
Thermal characteristics  
Symbol  
Per diode  
Rth(j-a)  
Parameter  
Conditions  
Min  
Typ  
Max Unit  
[1]  
[2]  
thermal resistance from  
junction to ambient  
in free air  
BAV70  
-
-
-
-
-
-
500  
500  
625  
K/W  
K/W  
K/W  
BAV70M  
BAV70W  
Rth(j-t)  
thermal resistance from  
junction to tie-point  
BAV70  
-
-
-
-
360  
300  
K/W  
K/W  
BAV70W  
Rth(j-sp)  
thermal resistance from  
junction to solder point  
BAV70S  
BAV70T  
-
-
-
-
255  
350  
K/W  
K/W  
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.  
[2] Reflow soldering is the only recommended soldering method.  
BAV70_SER_7  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 07 — 27 November 2007  
4 of 15  
 
 
 
 
 

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