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BA6209N PDF预览

BA6209N

更新时间: 2024-01-06 20:11:40
品牌 Logo 应用领域
罗姆 - ROHM 驱动器运动控制电子器件信号电路电动机控制电机
页数 文件大小 规格书
8页 132K
描述
Reversible motor driver

BA6209N 技术参数

生命周期:Obsolete零件包装代码:SIP
包装说明:SIP,针数:10
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.72
Is Samacsys:N模拟集成电路 - 其他类型:BRUSH DC MOTOR CONTROLLER
JESD-30 代码:R-PSIP-T10长度:25.2 mm
功能数量:1端子数量:10
最大输出电流:1.6 A封装主体材料:PLASTIC/EPOXY
封装代码:SIP封装形状:RECTANGULAR
封装形式:IN-LINE认证状态:Not Qualified
座面最大高度:7.2 mm最大供电电压 (Vsup):18 V
最小供电电压 (Vsup):6 V表面贴装:NO
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:SINGLE宽度:2.8 mm
Base Number Matches:1

BA6209N 数据手册

 浏览型号BA6209N的Datasheet PDF文件第2页浏览型号BA6209N的Datasheet PDF文件第3页浏览型号BA6209N的Datasheet PDF文件第4页浏览型号BA6209N的Datasheet PDF文件第5页浏览型号BA6209N的Datasheet PDF文件第7页浏览型号BA6209N的Datasheet PDF文件第8页 
Motor driver ICs  
BA6209 / BA6209N  
FOperation notes  
(1) Resistor dividing IC power consumption  
To reduce power dissipated in the IC, a resistance (about  
3X10)mustalwaysbeconnectedbetweenVCC andthe  
power supply pin of the driver circuit. If VCC2 is connected  
to VCC with no resistor, the IC can be damaged by over-  
current when operated at the voltage range close to the  
maximum operating voltage.  
This should be avoided by detecting the motor operating  
current in a way shown in Fig. 20.  
(2) Control signal waveform  
The rise and fall times of signals applied to the control  
pins should be 5ms or less. Longer times can cause er-  
ratic operation of the internal logic circuits and may result  
in damage to the driver circuits.  
(4) Input pins  
Voltage should never be applied to the input pins when  
the VCC voltage is not applied to the IC. Similarly, when  
VCC is applied, the voltage on each input pin should be  
less than VCC and within the guaranteed range for the  
electrical characteristics.  
(5) Back-rush voltage  
Depending on the ambient conditions, environment, or  
motor characteristics, the back-rush voltage may fluctu-  
ate. Be sure to confirm that the back-rush voltage will not  
adversely affect the operation of the IC.  
For example, if the supply voltage for the external control  
circuit comes up after the supply voltage of the IC, the ris-  
ing edge of the control signal slowly follows the rise of the  
externalsupplyvoltage. Thiscouldresultinerraticopera-  
tion or damage to the IC due to excess currents.  
(6) Large current line  
Largecurrentsarecarriedbythemotorpowersupplyand  
motor ground for these ICs.  
Therefore, the layout of the pattern of the PC board and  
the constants of certain parameters for external compo-  
nents, such as the capacitor between the power supply  
and ground, may cause this large output current to flow  
back to the input pins, resulting in output oscillation or  
other malfunctions. To prevent this, make sure that the  
PC board layout and external circuit constants cause no  
problems with the characteristics of these ICs.  
(7) Power dissipation  
(3) IC ground voltage  
To provide separation between the circuit elements with-  
in the IC, the GND pin of the IC must always be held at  
a lower potential than the other pins.  
The power dissipation will fluctuate depending on the  
mounting conditions of the IC and the ambient environ-  
ment. Make sure to carefully check the thermal design of  
the application where these ICs sill be used.  
(8) Power consumption  
IfthepotentialoftheGNDpinisallowedtoriseabovethat  
of other pins (such as the control input pins), separation  
between the internal circuit elements could break down,  
resulting in erratic operation or internal damage.  
For example, a resistor may be connected between GND  
(pin 1) and the ground as shown in Fig. 19, when detect-  
ing and controlling the motor operating current. In this  
case, thepotentialofpin1wouldbeabovethegroundpo-  
tential by an amount equal to the voltage drop across the  
resistor. Therefore, dropping the input pin potential to the  
ground potential would have the effect of applying a neg-  
ative voltage to the input pin.  
The power consumption by the IC varies widely with the  
power supply voltage and the output current. Give full  
consideration to the power dissipation rating and the  
thermal resistance data and transient thermal resistance  
data, to provide a thermal design so that none of the rat-  
ings for the IC are exceeded.  
391  

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