Datasheet > B58600E3224B604

B58600E3224B604

更新时间： 2024-03-03 10:09:03

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
10页	447K
描述
Pressure sensor die, for wet media, glass on back side, media-resistant

阅读下载

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

B58600E3224B604 数据手册

Pressure sensors

C32 series

B58600E32xxB604

Absolute pressure sensor die for wet media C32/2

Applications

 Medical devices

 Automotive

 Automation

Features

 Piezoresistive MEMS technology

 Small dimensions: 1.6 × 1.6 mm

 Square diaphragm

 Reference pressure chamber on top side

 Measured media (back side):

Non-aggressive gases and fluids.

Unsuitable for substances, which react with glass or silicon.

 Wheatstone bridge with mV output,

ratiometric to supply voltage

 Rated pressure range: 1.6 up to 25 bar

 Outstanding long-term stability

Delivery mode

 Tape, Tray

Dimensional drawings

150

A B

+100

400-0

1650±100

300±5

800±20

713

Note1

125

X10

allowable edge disruptions

80 µm max.

allowable edge disruptions

50 µm max.

X10

electrical diagram:

760

260

glass

BOROFLOATTM

1425

Si 100

glass

BOROFLOATTM

X10

Wire bond pad area

Bond wires should not touch die surface

outside specified area

Note1: geometry of diaphragm depends on

specification

X1 : Vout+

X2 : VDD–

X4 : Vout–

X5 : VDD+

all dimensions in µm

X10 : Substrate

TPS PRS SD PD

2021-03-19

Please read Cautions and warnings and

Page 2 of 10

Important notes at the end of this document.

123 4 5 6 7...10

下载PDF

与B58600E3224B604相关器件

型号	品牌	描述	获取价格	数据表
B58600E3224B615	TDK	Pressure sensor die, open bridge	获取价格
B58600E3224B646	TDK	Pressure sensor die, open bridge	获取价格
B58600E3224B709	TDK	Pressure sensor die, open bridge, high TCR	获取价格
B58600E3224B711	TDK	Pressure sensor die, open bridge, high TCR	获取价格
B58600E3225B604	TDK	Pressure sensor die, for wet media, glass on back side, media-resistant	获取价格
B58600E3225B615	TDK	Pressure sensor die, open bridge	获取价格