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B57153S0150M055 PDF预览

B57153S0150M055

更新时间: 2024-02-20 03:59:38
品牌 Logo 应用领域
爱普科斯 - EPCOS PC过载保护电阻器
页数 文件大小 规格书
3页 63K
描述
RESISTOR, TEMPERATURE DEPENDENT, NTC, 15ohm, THROUGH HOLE MOUNT, RADIAL LEADED

B57153S0150M055 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:,
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8533.40.80.70风险等级:5.82
JESD-609代码:e3安装特点:THROUGH HOLE MOUNT
端子数量:2最高工作温度:170 °C
最低工作温度:-55 °C封装形状:DISK PACKAGE
包装方法:AMMO PACK额定(AC)电压(URac):265 V
额定功率耗散 (P):1.4 W电阻:15 Ω
电阻器类型:NTC THERMISTOR表面贴装:NO
端子面层:Tin (Sn)端子位置:RADIAL
端子形状:WIRE热敏指数:2900 K
热敏电阻器应用:OVERLOAD PROTECTION容差:20%
Base Number Matches:1

B57153S0150M055 数据手册

 浏览型号B57153S0150M055的Datasheet PDF文件第2页浏览型号B57153S0150M055的Datasheet PDF文件第3页 
Inrush Current Limiters  
B57153  
S 153  
Applications  
ø8,5 max.  
6 max.  
I Switch-mode power supplies  
Features  
I Useable in series connections  
up to 265 Vrms  
ø0,6  
I Coated thermistor disk  
I Cost-effective NTC for low-power applications  
I Kinked leads of tinned copper wire  
I Small size  
5
TNT0410-3  
I UL approval (E69802)  
Delivery mode  
Dimensions in mm  
Approx. weight 0,6 g  
Bulk (standard),  
cardboard tape, reeled or in Ammo pack  
Climatic category (IEC 60068-1)  
55/170/56  
1,4  
20 %  
25  
Max. power at 25 °C  
Resistance tolerance  
Rated temperature  
Pmax  
RN/RN  
TN  
W
°C  
B value tolerance  
B/B  
δth  
τc  
3 %  
approx.  
approx. 30  
approx. 240  
Dissipation factor (in air)  
Thermal cooling time constant (in air)  
Heat capacity  
8
mW/K  
s
mJ/K  
Cth  
1)  
1)  
R25  
Imax  
No. of  
B25/100 CT  
CT  
Parameters for  
Ordering code  
(0 65 °C) R/T char-  
230 V 110 V R(I)1)  
A
acteristic  
K
µF  
µF  
k
n
4,7 3,0  
1202  
1202  
1203  
1302  
2800  
2800  
2900  
3000  
100  
100  
100  
100  
400  
400  
400  
400  
0,644  
0,838  
0,934  
1,180  
1,30  
1,30  
1,32  
1,33  
B57153S0479M000  
B57153S0100M000  
B57153S0150M000  
B57153S0330M000  
10  
2,0  
1,8  
1,3  
15  
33  
1) For details on the capacitance CT as well as on the parameters k and n refer to Application Notes, pages 4042.  
128 05/02  

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